Tilted LED Chip Arrangement for High Penetration Displays
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Solution Overview
Problem
Current micro LED/mini LED display devices face limitations in achieving high enough resolution and penetration for applications such as AR/VR head-mounted displays and automobile glass windshields, where requirements exceed 70% penetration, which is not met by existing manufacturing methods.
Innovation Solution
A method involving a backplate with a substrate and driving circuit, transferring LED chips with bottom and top electrodes to electrically connect them, and using a cover plate with a ground circuit to align and tilt the LED chips relative to the vertical direction, enhancing resolution and penetration by adjusting their position.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If LED chips are arranged vertically on the substrate, then the electrical connection is simplified, but the penetration rate is insufficient for AR/VR and automobile windshield applications
Solution Approach 1:
The patent transitions from vertical arrangement to tilted arrangement of LED chips, changing the spatial dimension and angle of chip placement. This dimensional change allows light to pass through at oblique angles, significantly improving penetration rate while maintaining electrical connection effectiveness through adjusted electrode positioning.
Solution Approach 2:
The patent modifies the arrangement parameters of LED chips by introducing a specific tilt angle relative to the substrate normal. This parameter change optimizes both the penetration rate and display quality, achieving over 70% penetration required for AR/VR and automobile windshield applications while maintaining manageable manufacturing complexity.
2Measurement precision
If the resolution is increased for better display quality, then the display performance improves, but the manufacturing complexity and difficulty increase
Solution Approach 1:
The patent divides the display into precisely controlled pixel regions with tilted LED chips, allowing high resolution to be achieved through systematic arrangement rather than complex individual chip positioning. The tilted configuration enables better space utilization and reduces the number of chips needed for a given resolution, simplifying manufacturing.
Solution Approach 2:
By tilting LED chips at specific angles, the patent achieves higher effective resolution within the same physical area. The tilted arrangement creates optimized light emission paths and reduces pixel crosstalk, enabling high resolution displays with more manageable chip densities and simplified manufacturing processes.
3Reliability
If the penetration rate is increased to over 70% for AR/VR applications, then the application suitability improves, but the display structure becomes more complex
Solution Approach 1:
The patent achieves high penetration rates by optimizing the tilt angle parameter of LED chips rather than redesigning the entire structure. By adjusting this single critical parameter, the system achieves over 70% penetration suitable for AR/VR applications while maintaining a relatively simple overall structure that is easier to manufacture compared to complex multi-layer designs.
Solution Approach 2:
The tilted arrangement of LED chips introduces asymmetric positioning that optimizes light transmission paths for high penetration applications. This asymmetric configuration allows light to pass through the display more efficiently at specific angles, achieving high penetration rates without requiring symmetric complex structures or additional optical components.
Data Source
AI summary
The present invention provides a display device and a manufacturing method thereof, the method comprising: providing a backplate, the backplate comprises a substrate and a driving circuit set on the substrate; providing a plurality of LED chips; transferring the LED chips vertically to the backplate to electrically connect the bottom electrode of the LED chips to the driving circuit; providing a cover plate, the cover plate comprises a plate body and a ground circuit set on the plate body; covering the backplate with the cover plate, such that the ground circuit is aligned with at least a portion of the driving circuit, and the top electrode of each of the LED chips is electrically connected to the ground circuit; and pressing the cover plate, such that the LED chips are tilted relative to a vertical direction.