TIM Resin Composition for Stable Viscosity and Filler Dispersion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Resin compositions used in thermal interface materials (TIMs) face issues with storage stability due to viscosity increases and oil separation, especially when filled with moisture-containing fillers, which can lead to contact failures in electrical products.
Innovation Solution
A resin composition incorporating a polymer compound with an organic acid anhydride functional group and a thermally conductive filler, which maintains a uniform mixing state and prevents viscosity increases even with excessive filler content and moisture, without requiring separate surface treatments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional resin components (epoxy, polyurethane, polysilicon) are used in TIM materials, then the material can be formed, but storage stability deteriorates due to viscosity increase from moisture reaction
Solution Approach 1:
The patent changes the chemical parameters of the resin component by selecting specific epoxy resins with particular molecular structures and curing agents that have low reactivity with moisture. This parameter change allows the resin to maintain stable viscosity even when fillers containing moisture are used, resolving the contradiction between forming the TIM material and maintaining storage stability.
Solution Approach 2:
The patent creates a composite resin system by combining specific epoxy resin components with carefully selected curing agents and fillers. This composite approach ensures that the resin-filler mixture maintains uniform mixing and stable viscosity during storage, while still achieving the desired thermal conductivity through excessive filler content.
2Temperature
If excessive filler is blended to obtain high thermal conductivity, then thermal performance improves, but storage stability worsens due to increased moisture content in filler
Solution Approach 1:
The patent changes the chemical composition parameters of the resin system to be less sensitive to moisture. By selecting epoxy resins and curing agents with specific reactivity characteristics, the system can accommodate excessive filler content (providing high thermal conductivity) without suffering from the usual moisture-induced viscosity increase, thus maintaining storage stability.
Solution Approach 2:
The patent converts the harmful effect of moisture in fillers into a beneficial situation by using a resin system that is inherently less reactive with moisture. The moisture that would normally cause problems is now tolerated by the resin, allowing excessive filler content to be used for high thermal conductivity without compromising storage stability.
3Temperature
If polysilicon series resin is used, then thermal conductivity can be improved, but miscibility with fillers worsens causing oil separation phenomenon
Solution Approach 1:
The patent changes the chemical parameters of the resin system by selecting epoxy resins with specific molecular structures and properties that are inherently more compatible with filler surfaces. This parameter change eliminates the oil separation phenomenon while still allowing excessive filler content to be used for achieving high thermal conductivity.
4Strength
If amide compound is used as curing agent for epoxy resin, then curing performance improves, but storage stability worsens due to rapid viscosity increase from moisture reaction
Solution Approach 1:
The patent changes the chemical parameters of the curing agent by selecting compounds with specific reactivity characteristics that provide good curing performance while having low reactivity with moisture during storage. This parameter change allows the system to maintain stable viscosity during storage while still achieving proper curing when needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The resin composition ensures stable viscosity over long-term storage and improved thermal conductivity, enhancing the reliability and efficiency of TIMs in applications like battery modules and packs.
Implementation Method 1
the polymer compound having an organic acid anhydride functional group reacts with moisture to prevent the resin composition from increasing in viscosity
Implementation Method 2
a thermally conductive filler... improved thermal conductivity
Data Source
AI summary
The present application relates to a resin composition comprising a polymer compound having an organic acid anhydride functional group, a two-component resin composition, and a battery module comprising the same. In the present application, it is possible to provide a resin composition in which a uniform mixing state can be maintained without any oil separation phenomenon and the like even in the composition in which a filler is blended, and there is no viscosity increase even when stored for a long period of time. In addition, the present application can provide a two-component resin composition comprising the resin composition, and a battery module comprising the resin composition or the two-component resin composition.