Timing Closure in Chip Design via Critical Path Variation Analysis
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current chip design methods struggle with timing closure due to inadequate consideration of wire and device delays, leading to increased chip design costs and inefficiencies, particularly in advanced manufacturing processes like 32 nanometers and 45 nanometers, where inter-die and intra-die violations significantly impact timing analysis.
Innovation Solution
A method and system that identify critical timing paths with smaller than predetermined timing windows, determine variations in each segment caused by factors like voltage and temperature, and modify these segments to enlarge the timing window, ensuring stable data transmission by replacing devices or wires with lower variation alternatives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If the timing window is reduced to increase time frequency, then the data transmission speed is improved, but the timing analysis accuracy deteriorates due to smaller timing margins
Solution Approach 1:
The patent applies preliminary action by identifying and analyzing critical timing paths before final chip design completion. The method performs timing analysis at multiple stages (post-synthesis, post-layout, post-extraction) to detect potential timing violations early, allowing designers to make adjustments before the design is finalized and sent to manufacturing. This proactive approach prevents timing closure failures that would occur with reduced timing windows.
Solution Approach 2:
The patent segments the timing analysis process into distinct phases: synthesis stage timing analysis, layout stage timing analysis, and post-extraction timing analysis. Each phase focuses on specific aspects of the design and uses appropriate timing models for that stage. This segmentation allows for more precise timing analysis at each level, improving overall timing accuracy even when the total timing window is reduced.
2Device complexity
If wire and device delays are not considered during design stage, then the design process is simplified, but timing closure fails due to inaccurate timing analysis
Solution Approach 1:
The patent incorporates wire and device delay considerations at preliminary stages of the design process. By performing timing analysis post-synthesis and post-layout with increasingly accurate delay models, the method ensures that timing constraints are met before design completion. This approach maintains design process simplicity while improving timing closure reliability through progressive refinement of delay information.
Solution Approach 2:
The patent changes the parameters used for delay calculation at different design stages. Initially, simplified delay models are used during synthesis, then more accurate models incorporating actual wire lengths and device characteristics are applied post-layout and post-extraction. This progressive parameter refinement allows the design process to remain manageable while achieving accurate timing analysis for timing closure.
3Productivity
If advanced manufacturing processes are used to improve chip performance, then the chip capabilities are enhanced, but timing violations increase due to predominant wire and device delays
Solution Approach 1:
The patent segments the timing analysis into multiple stages with increasing accuracy, specifically addressing the challenges of advanced manufacturing processes. By separating synthesis-stage analysis from post-layout and post-extraction analysis, the method can use appropriate delay models for each stage, accurately capturing wire and device delay effects that become predominant in advanced processes like 32nm and 45nm.
Solution Approach 2:
The patent implements feedback mechanisms where timing analysis results from each stage inform subsequent design decisions. Post-layout timing analysis feeds back to guide layout modifications, and post-extraction timing analysis feeds back to confirm timing closure. This iterative feedback process ensures that timing violations are identified and corrected, maintaining timing closure reliability even as chip performance is enhanced through advanced manufacturing processes.
Data Source
AI summary
Disclosed are a method and system for improving timing closure in chip design. The method comprises: identifying a critical timing path in a chip design pattern, wherein a timing window of the critical timing path is smaller than a predetermined timing window; determining a variation of each segment of the critical timing path, wherein the variation indicates uncertainty of delay of a device and/or a wire caused by one or more factors; and changing at least one segment of the critical timing path based on the variation of each segment of the critical timing path to enlarge the timing window of the critical timing path. The method and system may enlarge a timing window of a critical timing path by reducing the variation thereof, thereby achieving timing closure in the chip design pattern.


