Organic Tin-Boron Resist Composition for Low-Exposure Patterning
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The resist composition described in Non-Patent Document 1 has insufficient sensitivity, requiring considerable exposure to form a resist film (resist pattern).
Innovation Solution
A resist composition containing an organic tin compound and a predetermined organic boron compound, specifically a tin cluster with a Sn—O bond and a Sn—C bond, is developed to enhance sensitivity, allowing pattern formation with a low exposure amount.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional resist composition containing metal-containing compounds is used, then the resist film can be formed, but the sensitivity is insufficient and considerable exposure is required
Solution Approach 1:
The patent changes the chemical parameters of the resist composition by introducing specific organic tin compounds with Sn-O and Sn-C bonds, and organic boron compounds with specific structural formulas. This chemical parameter change results in enhanced sensitivity, allowing pattern formation with reduced exposure energy
Solution Approach 2:
The patent creates a composite resist composition by combining organic tin compounds and organic boron compounds in specific ratios. This composite material approach synergistically enhances the sensitivity of the resist system, enabling low-exposure patterning that neither component achieves alone
Data Source
AI summary
To provide a resist composition having high sensitivity and being able to form a pattern with a low exposure amount. A resist composition containing an organic tin compound and an organic boron compound represented by the following formula. (In the formula, R1, R2, and R3 each independently represent an organic group that bonds to boron by a carbon atom, an oxygen-containing organic group that bonds to boron by an oxygen atom, or OH. The oxygen-containing organic group may contain a boron atom. Two groups selected from the group consisting of R1, R2, and R3 may link to form a ring structure.)