Tin Organic Compounds TRIZ Cases
- Tin-Oxo Photoresist Composition for Low-LER EUV Patterning
A tin-oxygen double-bond photoresist uses light-triggered ligand dissociation to improve EUV pattern resolution, uniformity, and reproducibility.
- Organotin Metal-Containing Film Composition for Etch-Resistant Planarization
A tetravalent organotin film composition improves dry etch resistance while preserving filling, planarization, and low bake shrinkage.
- Tin Halide Perovskite Composition with en-Induced Hollow 3D Structure
Ethylenediammonium creates Schottky defects in tin halide perovskites, improving bandgap, film coverage, and ambient stability.
- Sn Organometallic Photoresist Composition for EUV Pattern Fidelity
A Sn-based photoresist with aryl unsaturated carboxylic acid improves EUV sensitivity, resolution, and line edge roughness for fine patterns.
- Tin Photoresist Composition for EUV Sensitivity and Low Edge Roughness
A tin organometallic photoresist with phosphate or sulfate additives improves EUV sensitivity, storage stability, and fine-pattern edge quality.
- Organotin Precursor Synthesis for High-Purity Tin Oxide Deposition
A Lewis base adduct route suppresses hard-to-separate polyalkyl by-products, yielding high-purity organotin precursors for tin oxide film deposition.
- Organometallic Photoresist Composition for EUV Resolution and Low LER
Blending two organometallic compounds with tailored ligands improves EUV photospeed, resolution, low LER, and storage stability.
- Conjugated Polymer Composition for Carrier Mobility and Solubility
A D-A conjugated polymer with indenofluorenochalcogenadiazole balances carrier mobility, heat resistance, and solubility for stable organic thin films.
- Organic Tin Photoresist Film for Low-LER EUV Patterning
Organic tin photoresist films improve EUV sensitivity while reducing line edge roughness for fine 5-100 nm pattern formation.