Titanium Nitride Etchant Inhibitor for Hydrogen Peroxide Stability
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Solution Overview
Problem
The decomposition of hydrogen peroxide in etching liquid compositions used for titanium nitride etching varies significantly depending on the material being etched, leading to shortened composition life, particularly when etching titanium nitride, due to the influence of metal ions from the etching target.
Innovation Solution
A decomposition inhibitor comprising azole compounds, aminocarboxylic acid compounds, and phosphonic acid compounds is added to the etching liquid composition to inhibit hydrogen peroxide decomposition, also preventing corrosion of copper and cobalt on semiconductor elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If hydrogen peroxide is used in etching liquid composition for titanium nitride, then etching capability is improved, but decomposition rate increases significantly
Solution Approach 1:
A decomposition inhibitor is introduced as an intermediary substance that mediates between hydrogen peroxide and metal ions. The inhibitor selectively binds to metal ions (particularly titanium ions from titanium nitride) to form stable complexes, preventing these ions from catalyzing hydrogen peroxide decomposition while allowing the etching process to proceed effectively
Solution Approach 2:
The invention changes the chemical environment parameters by adding the decomposition inhibitor, which alters the interaction between metal ions and hydrogen peroxide. This parameter change (introducing the inhibitor) reduces the decomposition rate constant without significantly affecting the etching rate, thus resolving the contradiction between etching capability and composition stability
2Duration of action of stationary object
If phosphonic acid-based chelating agent is added to prevent hydrogen peroxide decomposition, then decomposition is inhibited, but effectiveness varies for different metal films
Solution Approach 1:
The decomposition inhibitor is designed with multi-functionality to address different scenarios: it effectively inhibits hydrogen peroxide decomposition when etching titanium nitride, maintains stability for other metal films, and simultaneously provides corrosion inhibition for copper and cobalt. This universal applicability resolves the limitation of material-specific effectiveness
3Reliability
If triazole is added as corrosion inhibitor for copper, then copper loss is prevented, but hydrogen peroxide decomposition is not addressed
Solution Approach 1:
The invention merges multiple protective functions into a single decomposition inhibitor compound. The inhibitor simultaneously provides corrosion protection for copper and cobalt while preventing hydrogen peroxide decomposition, eliminating the need for separate additives for each function and resolving the contradiction between corrosion protection and peroxide stability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The inhibitor effectively prolongs the life of the etching liquid composition by reducing hydrogen peroxide decomposition and preventing corrosion, ensuring stable processing of semiconductor elements.
Implementation Method 1
a decomposition inhibitor comprising at least one compound selected from azole compounds, aminocarboxylic acid compounds and phosphonic acid compounds as an active component inhibits the decomposition of hydrogen peroxide
Implementation Method 2
when the decomposition inhibitor comprises an azole compound, in addition to inhibiting the decomposition of hydrogen peroxide, the decomposition inhibitor also prevents the corrosion of copper (Cu) and cobalt (Co) on a semiconductor element
Data Source
AI summary
The present invention addresses the problem of providing a decomposition inhibitor for inhibiting the decomposition of hydrogen peroxide included in an etching liquid composition for titanium nitride.The present invention relates to a decomposition inhibitor that is used to inhibit the decomposition of hydrogen peroxide included in an etching liquid composition for titanium nitride and that includes at least one compound selected from among azole compounds, aminocarboxylic acid compounds, and phosphonic acid compounds as an active component.