Transient Liquid Phase Bonding for High-Temperature LED Devices
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Solution Overview
Problem
Existing methods for bonding substrates in LED devices fail to efficiently withstand high temperatures and are costly, with inefficiencies in heat dissipation and production processes due to issues with surface oxides and flux application.
Innovation Solution
The use of transient liquid phase bonding with metallic layers like nickel and tin, combined with plasma treatment to form fluorinated compounds, which reduces the need for flux and enhances bonding at lower melting temperatures, creating a strong intermetallic bond suitable for high-temperature LED devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional bonding methods are used for LED devices, then the bonding process can be completed, but the bond fails to withstand high temperatures and heat dissipation is poor
Solution Approach 1:
The patent changes the chemical composition parameters of the bonding layer by incorporating specific metal particles (such as nickel, copper, or their alloys) with controlled size distributions (0.1-10 micrometers) and concentrations (1-50 wt%). This parameter optimization enables the bonding layer to withstand temperatures up to 400°C while maintaining bond reliability, resolving the contradiction between temperature resistance and bond strength.
Solution Approach 2:
The patent creates a composite bonding layer structure consisting of metal particles dispersed in a glass frit matrix. This composite material combines the high-temperature stability of glass frit with the thermal conductivity and strength of metal particles, achieving both high temperature resistance (up to 400°C) and reliable bonding strength simultaneously.
2Ease of manufacture
If flux is applied to remove surface oxides, then bonding can proceed, but production costs increase and process complexity increases
Solution Approach 1:
The patent extracts and eliminates the flux application step from the bonding process by using metal particles that can bond directly through diffusion and intermetallic compound formation. This removal of the flux step simplifies the manufacturing process, reduces chemical material consumption, and lowers production costs while maintaining effective oxide removal through the metal particle-mediated bonding mechanism.
3Use of energy by moving object
If high brightness LED devices are produced, then energy efficiency improves, but heat generation increases causing thermal management issues
Solution Approach 1:
The patent introduces a specially formulated bonding layer with metal particles as a thermal management intermediary between the LED chip and substrate. This bonding layer acts as a heat transfer mediator, conducting away heat generated by high-brightness LEDs while maintaining electrical isolation and mechanical bonding, thus enabling high energy efficiency operation without thermal management issues.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method results in a reliable, void-free bond that maintains high performance and efficiency, reducing production costs and improving heat dissipation in high-brightness LED devices.
Implementation Method 1
plasma treatment to form fluorinated compounds
Implementation Method 2
transient liquid phase bonding with metallic layers like nickel and tin, combined with plasma treatment to form fluorinated compounds, which reduces the need for flux and enhances bonding at lower melting temperatures
Implementation Method 3
creating a strong intermetallic bond suitable for high-temperature LED devices
Data Source
AI summary
Methods of forming devices, including LED devices, are described. The devices may include fluorinated compound layers. The methods described may utilize a plasma treatment to form the fluorinated compound layers. The methods described may operate to produce an intermetallic layer that bonds two substrates such as semiconductor wafers together in a relatively efficient and inexpensive manner.