TLVR Vertical Power VR Module With Integrated Leakage Inductance
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Solution Overview
Problem
Existing vertical power delivery designs for Application-Specific Integrated Circuits (ASICs) and processing units face challenges in efficiently delivering ultra-high currents while managing thermal design and complexity, particularly due to the need for significant decoupling capacitance and high-frequency operation.
Innovation Solution
The integration of Trans-Inductor Voltage Regulator (TLVR) technology in a vertical power Voltage Regulator (VR) module, which eliminates the need for a compensation inductor and reduces output capacitance, allowing for a simplified single-layer PCB structure and improved power density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If significant decoupling capacitance is included in the VR module to meet transient performance requirements, then transient performance is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent combines the output decoupling capacitance function with the PCB substrate by integrating capacitor structures directly into the PCB layers. This merging eliminates the need for separate capacitance components and complex multi-layer structures, while still providing the required transient performance through the integrated capacitance network.
Solution Approach 2:
The PCB substrate is designed to serve multiple functions simultaneously: it provides mechanical support, electrical connections, and integrated decoupling capacitance. This multi-functionality allows the VR module to achieve transient performance requirements without adding separate capacitance components or complex layer structures.
2Reliability
If VR module operates at very high frequency (greater than 5 MHz) to meet transient performance requirements, then transient performance is improved, but power loss increases and thermal design becomes more difficult
Solution Approach 1:
The patent changes the operating frequency parameter from very high frequency (greater than 5 MHz) to a lower frequency range. This parameter change reduces power loss and simplifies thermal design while maintaining transient performance through the integrated capacitance network and optimized power delivery architecture.
3Reliability
If compensation inductor is included in TLVR based power design, then transient performance is improved, but power density decreases due to space occupation
Solution Approach 1:
The patent merges the compensation inductor function with existing inductor structures already present in the TLVR circuit. By combining these functions into a single integrated structure, the design achieves the required transient performance without adding separate compensation inductors that would occupy additional space and reduce power density.
4Reliability
If multi-layer structure is used for VR module to include significant output capacitance, then transient performance is improved, but manufacturing complexity and weight increase
Solution Approach 1:
The patent integrates the output capacitance function directly into the PCB substrate structure, merging what would traditionally require separate capacitance components and complex multi-layer stacking into a unified single-layer or simplified multi-layer design. This integration maintains transient performance while significantly reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The TLVR-based vertical power VR module achieves enhanced transient performance, increased power density, reduced weight, and improved manufacturability, while also increasing the reliability and efficiency of the VR module.
Implementation Method 1
Inductors having a leakage inductance that acts as a compensation inductor
Data Source
AI summary
The subject matter described herein provides systems and techniques for the integration of TLVR technology in a vertical power VR module. A multiple-secondary TLVR topology using a controlled leakage inductance in the place of a separate compensation inductor, Lc, may be employed for the vertical power VR module. In addition, the capacitance inside the device to which the TLVR based vertical power VR module supplies power, rather than an output capacitance board, may be used in order to allow the module to be a single layer. Example structures that may include one or more primary windings and/or one or more secondary windings for each of possibly multiple linked phases of the TLVR based module are provided. The windings may be formed using traditional copper windings or printed circuit board (PCB) copper trace winding.