Optical Sensor Mounting Structure for Compact Toner Pattern Sensing

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Solution Overview

Problem

The challenge in miniaturizing toner pattern sensors for color image forming apparatuses is hindered by the presence of electronic components such as light-emitting elements, light-receiving elements, control ICs, and connectors on printed circuit boards, which makes it difficult to avoid interference with supporting members.

Innovation Solution

The implementation of a dual-sided mounting configuration for electronic components on printed circuit boards, where light-emitting and light-receiving elements are mounted on one surface and control components on another, along with a supporting member with a through-hole to accommodate the electronic components, allows for reduced sensor size and minimizes interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If electronic components are mounted on a single-sided printed circuit board, then the sensor size is larger, but the structure is simpler and easier to manufacture

Engineering Contradiction:
Improvesensor sizeVSAvoidPCB structure complexity
Core Design Contradiction:
Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent applies double-sided mounting of electronic components on the printed circuit board, utilizing both the front and back surfaces to accommodate components. This dimensional transition from single-sided to double-sided mounting reduces the overall sensor footprint while distributing components across two surfaces, thereby minimizing interference with the supporting member.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The patent positions electronic components within the area defined by the through-hole of the supporting member, effectively nesting the component layout within the available space. This nesting approach allows components to be arranged in a compact configuration that fits within the sensor's reduced footprint without interfering with the supporting structure.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Volume of moving object

If electronic components are mounted close to the supporting member, then the sensor is miniaturized, but interference between components and supporting member increases

Engineering Contradiction:
Improvesensor sizeVSAvoidinterference between components and supporting member
Core Design Contradiction:
Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The patent strategically positions electronic components within the through-hole area of the supporting member, nesting them in a way that utilizes the available space without causing interference. This nesting configuration allows the sensor to be miniaturized while maintaining adequate clearance between components and the supporting member structure.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

By transitioning to double-sided mounting, the patent distributes components across two surfaces of the PCB, effectively using the third dimension (depth/thickness) to resolve spatial conflicts. This allows components to be positioned on opposite sides of the PCB, reducing interference with the supporting member while achieving miniaturization.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Volume of moving object

If dual-sided mounting is implemented, then sensor miniaturization is achieved, but manufacturing complexity increases

Engineering Contradiction:
Improvesensor sizeVSAvoidPCB manufacturing ease
Core Design Contradiction:
Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent implements double-sided mounting by utilizing both surfaces of the printed circuit board. This approach, while reducing sensor size, employs standard PCB manufacturing techniques for bilateral component placement, making the increased complexity manageable through established fabrication processes rather than requiring novel manufacturing methods.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables the miniaturization of toner pattern sensors while ensuring stable support and reduced interference between electronic components and the supporting member, enhancing measurement accuracy and reliability.

Implementation Method 1

a light-emitting element mounted on a first mounting surface of the printed circuit board, a light-receiving element mounted on the first mounting surface of the printed circuit board

Methodology Applied
Scientific EffectLight emission: Light Emitting Diode

Implementation Method 2

an optical sensor configured to measure reflected light from the image on the image carrier

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS11809115B2Technique for attaching optical sensor to image forming apparatus
Publication Date: 2023.11.07 CANON KK
  • US11809115B2 patent drawing
  • US11809115B2 patent drawing
  • US11809115B2 patent drawing

AI summary

A printed circuit board has a first mounting surface and a second mounting surface. A light-emitting element and a light-receiving element are mounted on the first mounting surface. An electronic component for driving the light-emitting element is mounted on the second mounting surface. A supporting member supports the printed circuit board. The supporting member has a through-hole in which the electronic component is inserted when the printed circuit board is supported by the supporting member.