Top Gate TFT LCD Transparent Metal Adhesion Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing LCD device fabrication process is complex and time-consuming due to the use of multiple masks and sputtering processes, which increases the risk of errors and costs.
Innovation Solution
The implementation of a top gate type TFT LCD device with a reduced number of masks and sputtering processes, utilizing transparent metal layers to simplify the fabrication by enhancing adhesion and reducing the need for multiple masking and deposition steps, such as using Indium Tin Oxide (ITO) or Indium Zinc Oxide (IZO) for the metal layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple masks and sputtering processes are used in the fabrication process, then the manufacturing precision and adhesion are improved, but the device complexity and fabrication time increase
Solution Approach 1:
The patent combines multiple separate metal layers (transparent metal layer and data metal layer) into a single integrated structure that serves multiple functions. The transparent metal layer and data metal layer are formed simultaneously or in sequence without requiring separate masking processes for each, reducing the overall number of fabrication steps while maintaining the adhesion and electrical connection functions.
Solution Approach 2:
The transparent metal layer serves multiple functions: it provides adhesion between the substrate and the data metal layer, acts as an electrical connection path, and functions as part of the pixel electrode structure. This multi-functionality eliminates the need for separate dedicated layers for each function, simplifying the fabrication process.
2Manufacturing precision
If multiple masks and sputtering processes are used in the fabrication process, then the manufacturing precision is improved, but the productivity decreases
Solution Approach 1:
The patent merges the formation of the transparent metal layer and data metal layer into a single fabrication sequence, reducing the number of separate sputtering and masking cycles. This integration maintains pattern alignment precision while significantly reducing total fabrication time.
Solution Approach 2:
The transparent metal layer is formed in advance as a base layer before the data metal layer is deposited. This preliminary action establishes the adhesion and electrical connection foundation, allowing subsequent layers to be formed more efficiently with fewer corrective steps.
3Strength
If multiple masks and sputtering processes are used in the fabrication process, then the adhesion is improved, but the loss of time increases
Solution Approach 1:
The patent combines the adhesion function and electrical connection function into a single integrated metal layer structure, eliminating the need for separate adhesion layers and reducing the number of deposition steps required to achieve both functions simultaneously.
Solution Approach 2:
The transparent metal layer is designed to perform multiple functions including adhesion, electrical connection, and pixel electrode formation, eliminating the need for separate dedicated layers for each function and reducing overall fabrication time.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the fabrication time and increases the yield of LCD devices by minimizing the number of masking and sputtering processes, thereby simplifying the manufacturing process and enhancing the reliability of the devices.
Implementation Method 1
a first transparent metal layer formed on the transparent insulating substrate under the data line, the data line, a source electrode, and a drain electrode
Implementation Method 2
The conductive metal is deposited on the substrate using a physical vapor deposition (PVD) process (e.g., sputtering)
Data Source
AI summary
A liquid crystal display (LCD) device having an array substrate with a top gate type TFT includes a first transparent metal layer deposited to enhance the adhesion between a data metal layer and an insulating substrate before a data metal deposition, and a second transparent metal layer deposited to enhance the adhesion between a gate metal layer and an insulating substrate before a gate metal deposition. The LCD device having the array substrate with a top gate type TFT can be fabricated with a reduced number of masking or sputtering processes, thereby reducing the fabrication time of the LCD device and increasing the yield of the LCD device.