Touch Sensor Conductive Layer Integration on Planarization
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Solution Overview
Problem
Display devices face challenges in integrating touch sensors effectively, leading to increased manufacturing costs, reduced transmittance, and increased reflectance due to the need for additional processes and adhesive layers, which also compromise the encapsulation and moisture protection of the device.
Innovation Solution
A display device design that includes a conductive layer formed on an encapsulation member without increasing dead space or parasitic capacitance, using a planarization layer with a tapered structure and alternately layered inorganic and organic encapsulation members to expose pad electrodes for touch sensor connections, thereby enhancing touch sensitivity and reducing haze.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a touch sensor part is adhered separately on the display device, then the touch sensing function is achieved, but the manufacturing yield decreases and manufacturing cost increases
Solution Approach 1:
The touch sensor part is merged with the display device by forming the touch sensor electrodes and conductive layers directly on the display device structure during the same manufacturing process, eliminating separate production and assembly steps, thereby improving manufacturing yield and reducing costs while maintaining touch sensing functionality
2Strength
If adhesive layers are used to affix the touch sensor part, then the touch sensor is secured to the display device, but the thickness of the display device increases
Solution Approach 1:
The adhesive layer is completely removed from the structure by forming the touch sensor conductive layers directly on the display device surfaces, achieving adhesion through direct electrical and structural integration rather than mechanical bonding, thereby eliminating the thickness increase caused by adhesive layers
3Ease of operation
If adhesive layers are positioned between the touch sensor part and display device, then the touch sensor is mounted, but transmittance decreases and reflectance increases
Solution Approach 1:
Adhesive layers are completely eliminated by directly forming touch sensor conductive layers on the display device surfaces during the manufacturing process, removing the optical interference caused by adhesives and thereby maintaining high transmittance and low reflectance while achieving secure sensor integration
4Ease of operation
If additional processes are used for manufacturing the touch sensor part separately, then the touch sensor can be produced, but manufacturing cost increases
Solution Approach 1:
The manufacturing processes for the touch sensor part are merged with the display device manufacturing process by forming all touch sensor electrodes, conductive layers, and structural elements simultaneously with the display device components using the same fabrication techniques, eliminating the need for separate production lines and reducing overall manufacturing costs
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces dead space and parasitic capacitance, improves touch sensitivity, and maintains the encapsulation's effectiveness in preventing moisture ingress, while also simplifying the manufacturing process and maintaining the display's optical properties.
Implementation Method 1
an encapsulation process may be performed on the electric element included in the display device in order to separate the electric element from the outside
Implementation Method 2
A sidewall of the planarization layer corresponding to the contact hole may have a tapered structure
Implementation Method 3
The conductive layer is disposed on the planarization layer. The conductive layer contacts the portion of the pad electrode exposed through the contact hole
Implementation Method 4
the encapsulation member may be formed by alternately depositing a plurality of organic layers and a plurality of inorganic layers on the lower substrate
Data Source
AI summary
A display device includes a substrate, a pad electrode, a pixel electrode, an opposite electrode, an encapsulation member, a planarization layer, and a conductive layer. The substrate includes a display region and a peripheral region. The pad electrode is disposed on the substrate in the peripheral region. The pixel electrode and the opposite electrode are disposed on the substrate in the display region. The encapsulation member is disposed on the opposite electrode. The planarization layer is disposed on the encapsulation member in the display region and the peripheral region. The conductive layer is disposed on the planarization layer. The planarization layer includes a contact hole exposing at least a portion of the pad electrode. The conductive layer contacts the portion of the pad electrode exposed through the contact hole.