Touch Sensor Terminal Connection Structure for Miniaturized Displays
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Solution Overview
Problem
The increasing size of display screens in electronic equipment and the desire for reduced frame size not contributing to the display screen pose challenges in achieving space-saving designs for touch sensor built-in display devices, particularly in the connection structure between circuit substrates.
Innovation Solution
A terminal connection structure is developed where plural first connection terminals on a first circuit substrate are arranged side by side and connected to plural second connection terminals on a second resin circuit substrate, with the second terminals having wirings that cross the first direction and a second wiring extending in the same direction, positioned in the overlapping region, allowing for efficient space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the display screen size is increased, then the display area is improved, but the frame size not contributing to the display screen increases
Solution Approach 1:
The patent applies dimensionality change by transitioning from a planar connection structure to a three-dimensional overlapping structure. The second circuit substrate is positioned to overlap the first circuit substrate in the vertical direction, allowing connection terminals to be arranged in multiple layers. This vertical stacking enables more efficient space utilization and reduces the horizontal frame size while maintaining large display screen area.
Solution Approach 2:
The patent implements nesting by placing the second circuit substrate within the projection area of the first circuit substrate. The connection terminals are arranged such that terminals on the second substrate are positioned over or adjacent to terminals on the first substrate, creating a nested configuration. This nesting approach minimizes the overall footprint and reduces the non-display frame size.
2Device complexity
If the connection terminals are arranged in a conventional manner, then the connection structure is simple, but the frame size increases
Solution Approach 1:
The patent resolves this contradiction by introducing vertical stacking of connection terminals across multiple substrates. Instead of arranging all terminals in a single plane, the invention uses the vertical dimension to layer terminals, thereby reducing horizontal space requirements and frame size while accepting increased structural complexity.
Solution Approach 2:
The patent applies segmentation by dividing the connection terminal structure into multiple independent terminals arranged in specific patterns across different substrates. The connection terminals are segmented into first connection terminals on the first substrate and second connection terminals on the second substrate, with specific arrangement patterns that optimize space utilization while managing complexity.
3Area of stationary object
If the second wiring is positioned in the overlapping region, then the space utilization is improved, but the wiring complexity increases
Solution Approach 1:
The patent applies dimensionality change by positioning the second wiring in the overlapping region of the two substrates, utilizing the vertical space between substrates. This allows wirings to route through the overlap area rather than requiring additional horizontal space, thereby improving space utilization while accepting increased wiring path complexity.
Solution Approach 2:
The patent implements local quality by concentrating the second wiring specifically in the overlapping region rather than distributing it uniformly. This localized placement optimizes space utilization in the critical overlap area while managing wiring complexity through targeted rather than universal complexity.
Data Source
AI summary
A terminal connection structure includes plural first connection terminals which are arranged side by side in one direction on a first circuit substrate, and plural second connection terminals which are arranged side by side in the one direction on a second resin circuit substrate overlappingly connected to the first circuit substrate and are respectively connected to the plural first connection terminals. Each of the plural second connection terminals includes plural first wirings extending in a direction crossing the one direction, and a second wiring connected to the plural first wirings and extending in the one direction. The second wiring is provided in a region where the second circuit substrate is overlapped and connected to the first circuit substrate.