Touch Substrate Bonding PINs for OGS Signal Integrity
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Solution Overview
Problem
In One Glass Solution (OGS) touch-control technologies, touch electrodes far from the signal input end experience signal attenuation due to resistance, leading to inaccurate touch detection as the signal intensity decreases or becomes non-existent, preventing effective touch detection.
Innovation Solution
A touch substrate with intersected touch electrodes connected to bonding PINs arranged side by side without contact, featuring concaved and convex parts on their edges to ensure uniform pressure and prevent signal interference, when bonded with a flexible printed circuit (FPC) through an anisotropic conductive film, reducing the likelihood of failed conduction and ensuring consistent signal intensity across the electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If touch electrodes are arranged intersected on a base substrate in OGS technology, then the structure can be simplified and weight/thickness reduced, but signal attenuation occurs in electrodes far from the signal input end due to resistance, leading to inaccurate touch detection
Solution Approach 1:
The patent divides the signal transmission path into multiple segments by introducing intermediate signal distribution nodes. Instead of a single long electrode receiving attenuated signals, the electrode network is segmented into multiple sections with intermediate nodes that redistribute signals, ensuring each segment receives adequate signal strength for accurate touch detection.
Solution Approach 2:
The patent introduces intermediate signal distribution nodes as mediators between the signal input end and distant touch electrodes. These intermediate nodes act as signal regeneration points that receive signals from the input end and redistribute them to multiple electrode segments, preventing signal attenuation and maintaining detection accuracy across the entire electrode network.
2Area of stationary object
If bonding PINs are arranged closely to reduce spacing, then the device size is reduced, but failed conduction occurs between bonding PINs and FPC due to insufficient bonding area and uneven pressure distribution
Solution Approach 1:
The patent applies different structural features to different parts of the bonding PIN arrangement. The bonding PINs are equipped with convex and concave structures that create localized bonding zones with optimized pressure distribution. This local quality enhancement ensures reliable conduction in the bonding region without increasing the overall device size.
Solution Approach 2:
The patent introduces convex and concave curved structures on the bonding PIN surfaces. These curved features increase the bonding contact area and improve pressure distribution during the bonding process, ensuring reliable electrical connection between the bonding PINs and the FPC while maintaining compact dimensions.
3Area of stationary object
If signal lines are extended to reach distant touch electrodes, then complete electrode coverage is achieved, but signal attenuation increases due to resistance, causing weak or nonexistent signals at the electrode ends
Solution Approach 1:
The patent segments the electrode network into multiple sections with intermediate signal distribution nodes. This segmentation breaks the long signal transmission path into shorter segments, reducing cumulative resistance and signal attenuation in each segment while maintaining complete electrode coverage.
Solution Approach 2:
The patent introduces intermediate signal distribution nodes as mediators that receive signals from the input end and redistribute them to multiple electrode segments. These intermediaries prevent signal degradation by ensuring each electrode segment receives sufficient signal strength, maintaining detection accuracy across the entire covered area.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the accuracy of touch detection by maintaining consistent signal intensity across the touch electrodes, reducing the occurrence of failed conduction and improving the reliability of touch detection in OGS touch screens.
Implementation Method 1
bonded with a flexible printed circuit (FPC) through an anisotropic conductive film
Data Source
AI summary
A touch substrate and a touch display device are provided. The touch substrate includes a plurality of touch electrodes arranged to be intersected on a base substrate, two ends of each of the touch electrodes being connected to two bonding PINs constituting a PIN group; the two bonding PINs in every PIN group being arranged side by side along a width direction of the bonding PIN, and being adjacent with each other without contact there-between.