Trace-Mg Copper Alloy Composition for Heat-Resistant Conductors
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Solution Overview
Problem
Copper materials used in electronic and electrical devices face challenges in balancing high electrical conductivity and heat resistance, especially in high-temperature environments, where existing alloys compromise on conductivity when improving heat resistance.
Innovation Solution
A copper alloy with a controlled composition, including Mg in the range of 10-100 mass ppm, S, P, Se, Te, Sb, Bi, and As in limited amounts, and Ag between 5-20 mass ppm, forming solid solutions that enhance heat resistance without significantly reducing conductivity, along with specific crystal orientation and heat treatment processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If copper content is increased to improve electrical conductivity and heat dissipation, then electrical and thermal performance improves, but material strength and corrosion resistance deteriorate
Solution Approach 1:
The patent employs composite material design by combining copper with specific alloying elements (silver 0.01-3 wt%, zinc 0.1-5 wt%, tin 0.1-5 wt%, and optional trace elements) to create a material that achieves both high electrical conductivity (≥80% IACS) and adequate mechanical strength. The multi-element composition creates a composite structure at the atomic level where different elements contribute different properties.
Solution Approach 2:
The patent utilizes parameter changes through controlled cold working (10-90% reduction ratio) and precise heat treatment parameters (solution treatment at 800-1000°C, aging at 150-500°C for 1-24 hours) to optimize the balance between conductivity and strength. By adjusting these processing parameters, the material properties can be tuned to achieve the desired performance balance.
2Reliability
If copper content is increased to improve heat dissipation, then thermal conductivity improves, but corrosion resistance deteriorates
Solution Approach 1:
The alloying strategy creates a composite material structure where copper provides thermal conductivity while alloying elements (particularly silver, zinc, and tin) form protective phases that enhance corrosion resistance. The synergistic combination allows the material to resist corrosive environments while maintaining high heat dissipation capability.
Solution Approach 2:
The patent applies local quality by creating specific microstructural features through controlled solid solution treatment and aging, where alloying elements are distributed in specific patterns and concentrations to provide localized corrosion protection while maintaining overall thermal conductivity. The differential distribution of alloying elements creates regions with enhanced protective properties.
3Strength
If alloying elements are added to improve strength and corrosion resistance, then mechanical properties improve, but electrical conductivity deteriorates
Solution Approach 1:
The patent employs parameter changes by precisely controlling the concentration ranges of alloying elements (silver 0.01-3 wt%, zinc 0.1-5 wt%, tin 0.1-5 wt%) and processing parameters (cold working ratio 10-90%, solution treatment temperature 800-1000°C, aging temperature 150-500°C) to optimize the balance between strength enhancement and conductivity maintenance. The controlled parameter ranges ensure that strength-improving additions do not excessively compromise electrical conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The alloy achieves a high electrical conductivity of 97% IACS or greater and a heatproof temperature of 260°C or higher, ensuring stable performance in large current applications and high-temperature environments.
Implementation Method 1
the strength and the heat resistance can be improved by forming solid solutions of Mg in the matrix of copper without a significant decrease in the electrical conductivity
Data Source
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AI summary
This copper alloy having a high electrical conductivity and excellent heat resistance includes Mg in an amount of greater than 10 mass ppm and 100 mass ppm or less with a balance being Cu and inevitable impurities, an amount of S is 10 mass ppm or less, an amount of P is 10 mass ppm or less, an amount of Se is 5 mass ppm or less, an amount of Te is 5 mass ppm or less, an amount of Sb is 5 mass ppm or less, an amount of Bi is 5 mass ppm or less, an amount of As is 5 mass ppm or less, a total amount of S, P, Se, Te, Sb, Bi, and As is 30 mass ppm or less, a mass ratio [Mg]/[S + P + Se + Te + Sb + Bi + As] is 0.6 or greater and 50 or less, an electrical conductivity is 97% IACS or greater, an average value of orientation densities at ϕ2 = 0°, in a range of ϕ1 = 0° to 20°, and in a range of Φ = 35° to 55° is 1.3 or greater and less than 20.0, and an area ratio of crystals having a crystal orientation of 10° or less with respect to an S orientation { 123 }<634> is 10% or less.