Transfer Apparatus Segmented Electrostatic Chucking
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Solution Overview
Problem
Conventional cluster tools have limited substrate throughput due to the restriction of transferring only two substrates simultaneously and require multiple sensors for accurate positioning, leading to increased costs and complexity.
Innovation Solution
A transfer apparatus with a hub and multiple transfer arms, each coupled to substrate-supporting members with electrical interface connections for electrostatic chucking, allowing for the simultaneous transfer of multiple substrates and reducing the need for complex sensor systems, while enabling rotational operation and controlled heating/cooling under vacuum.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional vacuum robots are used for substrate transfer, then positioning accuracy is maintained, but substrate throughput is limited to two substrates simultaneously
Solution Approach 1:
The substrate-supporting member is divided into multiple segments (first and second substrate-supporting portions) that can independently hold and transfer substrates. This segmentation allows multiple substrates to be handled simultaneously on a single transfer arm, increasing throughput without requiring multiple complex sensor systems for each individual substrate position.
Solution Approach 2:
The electrical interface connection serves multiple functions: it provides electrostatic chucking force to hold the substrate, enables heating/cooling of the substrate, and potentially provides electrical connections for processing. This multi-functionality reduces the need for separate sensor and control systems for each function, thereby reducing overall device complexity while maintaining positioning accuracy.
2Measurement precision
If multiple sensors are used for accurate positioning, then positioning precision is improved, but system cost and complexity increase
Solution Approach 1:
The patent replaces complex mechanical sensor systems with an electrostatic field-based positioning system. The electrical interface connection creates an electrostatic field that not only holds the substrate but also enables precise positioning through field control, eliminating the need for multiple physical sensors while maintaining positioning accuracy.
Solution Approach 2:
The electrical interface connection integrates multiple functions including positioning, holding (electrostatic chucking), and thermal control into a single system. This consolidation reduces the number of separate sensor and control systems needed, thereby reducing device complexity while maintaining the required positioning precision through the unified control mechanism.
3Productivity
If a single substrate-supporting member is used per transfer arm, then mechanical structure is simple, but substrate transfer capacity is limited
Solution Approach 1:
The substrate-supporting member is segmented into multiple functional portions (first and second substrate-supporting portions) that can independently interact with substrates through separate electrical interface connections. This segmentation enables the single transfer arm to handle multiple substrates simultaneously, increasing productivity while the modular electrical connection structure keeps the added complexity manageable and organized.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution increases substrate throughput, reduces system complexity, and improves mechanical droop, resulting in higher adaptability and efficiency with a smaller footprint compared to conventional cluster tools.
Implementation Method 1
a first electrical interface connection for electrostatically chucking a substrate and located at a first position on each substrate-supporting member
Implementation Method 2
the hub is rotatable when the plurality of electrical interface connections are electrically connected to a power supply
Data Source
AI summary
Embodiments of the present disclosure generally relate to methods and apparatus for processing substrates. More specifically, embodiments of the present disclosure relate to transfer apparatus and substrate-supporting members. In an embodiment, an apparatus for transferring a substrate is provided. The apparatus includes a hub and a plurality of transfer arms extending from the hub. The apparatus further includes a plurality of substrate-supporting members, wherein each of the transfer arms has a first end coupled to the hub and a second end coupled to a respective one of the plurality of substrate-supporting members. The apparatus further includes a first electrical interface connection for electrostatically chucking a substrate and located at a first position on each substrate-supporting member, and a second electrical interface connection for electrostatically chucking the substrate and located at a second position on each substrate-supporting member. Substrate processing modules are also described.