Transfer Film with Lacquer Grid for Security Elements
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Solution Overview
Problem
Existing methods struggle to transfer thin, motif-shaped security elements without an integrated carrier film to a target substrate due to their low stability, often resulting in contamination of the substrate with fragmental layer structures.
Innovation Solution
A transfer film with a stable lacquer layer provides the necessary stability for separating non-transfer areas from a temporary carrier film, allowing for the transfer of thin security element layer structures without a carrier film, using a punch or laser to create dividing lines that extend into the temporary carrier film, and a stabilization layer that can be height-structured and applied in specific regions for anchoring the security elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If thin security elements without an integrated carrier film are used, then the security elements achieve maximum thinness and flexibility, but their layer structure becomes inherently unstable and difficult to transfer without contamination
Solution Approach 1:
A stable lacquer layer is introduced as an intermediary between the thin security element layer structure and the temporary carrier film. This lacquer layer provides the necessary mechanical stability and adhesion during the transfer process, enabling thin security elements without carrier films to be handled and transferred without fragmentation or contamination.
Solution Approach 2:
The stable lacquer layer is applied in advance to the temporary carrier film before the security element layer structure is transferred. This preliminary stabilization allows the thin layer structure to be positioned and prepared for transfer without risking damage or contamination during subsequent handling and punching operations.
2Volume of moving object
If the security element layer structure is made thin without a carrier film, then the security element achieves maximum thinness, but it becomes difficult to separate non-transfer areas cleanly from the transfer film
Solution Approach 1:
The stable lacquer layer acts as a mediator between the thin security element structure and the temporary carrier film, providing sufficient mechanical strength to allow clean separation of non-transfer areas through punching or laser cutting without fragmenting the thin layer structure.
Solution Approach 2:
The temporary carrier film is divided into transfer areas and non-transfer areas through punching or laser cutting. The stable lacquer layer enables this segmentation by providing the necessary structural integrity to the thin security element layer structure during the separation process, allowing non-transfer areas to be cleanly removed.
3Reliability
If a stable lacquer layer is added to provide structural integrity, then the transfer process becomes reliable, but the overall thickness of the transferred element increases
Solution Approach 1:
The stable lacquer layer is designed with optimized thickness and material properties to provide sufficient structural integrity and adhesion for reliable transfer while minimizing thickness increase. The lacquer layer's parameters (thickness, composition, curing characteristics) are specifically tuned to balance structural support with minimal added volume.
Solution Approach 2:
The stable lacquer layer is applied selectively in regions where structural support is needed during transfer, rather than uniformly across the entire security element. This localized application provides necessary stability for transfer reliability while minimizing the overall thickness increase of the final transferred element.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable and contamination-free transfer of thin, motif-shaped security elements to a target substrate, maintaining the security element's thinness and stability, while preventing fragmental contamination and ensuring secure anchoring.
Implementation Method 1
The stabilization layer is in particular in the form of a UV-curing or electron beam-curing lacquer layer
Implementation Method 2
The separation is preferably carried out by a punch, for example a mechanical punch or a laser punch
Data Source
Figure 1~3
Figure 4~5
AI summary
The invention relates to a transfer film (20) for transferring motif-shaped security elements (12) from transfer areas (40) of the transfer film (20) onto a target substrate, comprising a security element layer structure (26) with a plurality of layers which, after transfer from the transfer areas (40), form the desired security elements (12) on the target substrate, and a temporary carrier film (22) for generating the security element layer structure (26), which is detachably connected to the security element layer structure (26).According to the invention, it is provided that a stabilizing layer (28) present at least in some areas in the form of a tough lacquer layer is firmly connected to the safety element layer structure (26) and forms a stable lacquer grid (30) with it, which, after a separation step to form motif-shaped transmission areas (40) and non-transmission areas (42), can be removed from the temporary carrier film (22) in the non-transmission areas (42).