Transfer Film Encapsulation for Semiconductor Package Reliability
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Solution Overview
Problem
Conventional redistributed chip packaging is unreliable due to susceptibility of dies to damage during assembly, leading to increased waste and reduced reliability.
Innovation Solution
A method involving the use of transfer films for encapsulating and forming electrical distribution layers on integrated circuit dies, followed by singulation and additional encapsulation to create a package-in-package device, ensuring only known good packages are used, increasing reliability and reducing waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional redistributed chip packaging is used with direct die assembly, then the packaging process is simple, but the reliability is reduced due to die damage susceptibility
Solution Approach 1:
The patent applies preliminary action by performing molding encapsulation on individual dies before assembly into the final package. This preliminary molding protects the dies from damage during subsequent handling and assembly operations, thereby improving reliability while managing process complexity through staged fabrication
Solution Approach 2:
The packaging process is segmented into distinct stages: first molding individual dies with protective encapsulation, then assembling these pre-encapsulated dies into the final package structure. This segmentation allows each stage to be optimized independently, improving overall reliability without excessive complexity
2Loss of substance
If conventional direct die assembly is used, then the manufacturing process is straightforward, but waste increases due to damaged dies
Solution Approach 1:
The patent implements beforehand cushioning by applying molding compound encapsulation to dies before assembly. This protective encapsulation acts as a cushion that prevents mechanical damage during subsequent handling, transfer, and assembly operations, thereby reducing die waste while maintaining reasonable manufacturing ease
3Object-affected harmful factors
If multiple dies are packaged without individual protection, then the assembly process is simple, but susceptibility to damage during assembly increases
Solution Approach 1:
The patent uses molding compound to create protective encapsulation shells around individual dies. This flexible protective layer shields the fragile die surfaces from mechanical damage during assembly operations, reducing damage susceptibility while the modular nature of the process keeps complexity manageable
Data Source
AI summary
A method of forming a semiconductor package includes providing a transfer film and placing electronic components on the transfer film with active sides of the electronic components facing the transfer film. The electronic components include a first assembled package and one or more of a second assembled package and a passive component. A molding operation is performed to encapsulate the electronic components and one side of the transfer film. The transfer film is then removed, which exposes the active sides of the electronic components. An electrical distribution layer is formed over the active sides of the electronic components and electrically connects the electronic components. Conductive bumps are then formed on the electrical distribution layer.