Transfer Film for Tactile 3D Structures on Security Documents
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Solution Overview
Problem
Existing methods for forming three-dimensional structures on value or security documents are complex and costly, particularly for producing tactile features, which require expensive materials and intricate processes, and are not suitable for sensitive substrates with internal electronic components.
Innovation Solution
A method involving a structure-forming film where film elements are mechanically separated and inextricably bonded to the substrate surface using local application of a solvent or swelling agent, allowing for precise and efficient creation of tactile structures without additional adhesion promoters, and enabling the formation of fine details and complex patterns.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If existing methods are used to form three-dimensional structures on value or security documents, then tactile features can be produced, but the process becomes complex and costly with expensive materials and intricate steps
Solution Approach 1:
The patent extracts and eliminates unnecessary intermediate steps from existing methods. Instead of applying marking material separately to the substrate for each feature as in EP 2 161 314 B1, the invention transfers pre-formed film elements directly onto the substrate in a single operation, removing the complexity of multiple sequential printing steps while maintaining tactile structure formation capability
Solution Approach 2:
The transfer film serves multiple functions simultaneously: it provides the tactile three-dimensional structure, acts as the source material for transfer, and enables precise positioning through mechanical separation. This multi-functionality eliminates the need for separate adhesion promoters and multiple processing steps required by existing methods, reducing both process complexity and material costs
2Manufacturing precision
If existing methods are used to form three-dimensional structures, then tactile features can be created, but the production becomes tedious and complex to apply
Solution Approach 1:
The patent performs preliminary action by pre-forming the three-dimensional structure within the transfer film before the transfer process. The film elements are prepared with their final three-dimensional configuration in advance, allowing direct transfer to the substrate without requiring complex in-situ formation processes. This preliminary preparation significantly simplifies the application process while maintaining manufacturing precision
Solution Approach 2:
The invention uses a copy approach where the three-dimensional structure is first created in the transfer film and then copied onto the substrate through mechanical transfer. This copying mechanism allows the complex tactile features to be formed once in the film and replicated on the substrate, making the application process straightforward and easy to manufacture compared to building structures directly on the substrate
3Manufacturing precision
If existing methods are used to form three-dimensional structures, then tactile structures can be produced, but expensive materials are required
Solution Approach 1:
The patent applies discarding and recovering by using a transfer film that is discarded after a single use. The film elements are transferred to the substrate, and the remaining film is discarded. This approach eliminates the need for expensive, specialized materials that would need to be applied directly to the substrate, as the transfer film can be made from more economical materials while still achieving the desired tactile structure production
4Manufacturing precision
If existing methods are used to form three-dimensional structures, then tactile features can be created, but the methods are not suitable for sensitive substrates with internal electronic components
Solution Approach 1:
The transfer film acts as an intermediary that enables tactile structure formation without direct contact or harsh processing on the substrate. The film elements are transferred through a gentle mechanical process that does not require high heat, strong chemicals, or complex equipment that would damage sensitive electronic components. This intermediary approach makes the method adaptable to substrates with internal electronic components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the easy and cost-effective production of tactile three-dimensional structures on security documents, including those with sensitive electronic components, with precise control over structure height and design, allowing for both tactile perception and mechanical or optical detection.
Implementation Method 1
local application of a solvent or swelling agent for the structure-forming material of the film and/or for the material of the substrate
Implementation Method 2
local application of a solvent or swelling agent for the structure-forming material of the film and/or for the material of the substrate
Data Source
Figure 1~2
Figure 3(A)~3(D)
Figure 4~5
AI summary
For the simple and inexpensive production of elevated structures on a substrate (100), a method for forming at least one three-dimensional structure (400, 400') on at least one surface (101) of the substrate (100) is proposed. The method comprises the following method steps: a) provision of the substrate (100) and a structure-forming material in the form of a film (200), b) mechanical separation of at least one film element (210) from film part regions (230) which do not correspond to the at least one film element (210), and c) non-releasable connection of the at least one film element (210) to the at least one surface (101) of the substrate (100) in in each case one adhesion region (160) of the substrate (100), with the result that the at least one film element (210) forms the at least one three-dimensional structure (400, 400') on the at least one surface (101) of the substrate (100).