Transfer Head Array Recesses for Micro Device Height Variance
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Solution Overview
Problem
Current micro device transfer technologies face challenges in efficiently transferring micro devices with varying heights onto receiving substrates without mechanical interference, especially in indirect bonding methods where devices need to be picked up and placed accurately.
Innovation Solution
A transfer head array with recesses in its body to accommodate devices of different heights, combined with electrostatic or adhesive gripping mechanisms to securely transfer micro devices onto a receiving substrate, ensuring accurate placement and avoiding mechanical interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional direct bonding or indirect bonding methods are used to transfer micro devices, then the transfer process can be completed, but mechanical interference occurs when devices with varying heights are transferred, reducing manufacturing precision
Solution Approach 1:
The transfer head introduces a vertical dimension solution by creating recesses at different depths in the body. These recesses accommodate devices of varying heights, allowing all devices to be held at the same vertical level during transfer. This dimensional approach eliminates mechanical interference while maintaining precise placement accuracy.
Solution Approach 2:
Different regions of the transfer head body are designed with different local qualities - specifically, recesses of varying depths at different locations. This allows each device position to be customized for its specific height requirements, preventing mechanical interference while maintaining overall transfer precision.
2Reliability
If transfer head picks up array of devices and moves them to receiving substrate, then device transfer is achieved, but devices may be misplaced or lost during the transfer process, reducing reliability
Solution Approach 1:
The transfer head body is segmented into multiple recesses, each capable of independently holding a device. This segmentation allows each device to be securely captured in its designated recess, preventing misplacement or loss during transfer while maintaining precise positioning through the structured arrangement of recesses.
3Strength
If electrostatic or adhesive gripping mechanisms are used to secure micro devices, then device grip strength is improved, but the complexity of the transfer head structure increases
Solution Approach 1:
The patent replaces complex mechanical gripping mechanisms with electrostatic or adhesive gripping fields. This substitution provides strong grip force to secure devices in the recesses without requiring complex mechanical structures, thus maintaining reliability while controlling structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the precise and interference-free transfer of micro devices with varying heights onto receiving substrates, enhancing the efficiency and reliability of micro device assembly processes.
Implementation Method 1
electrostatic or adhesive gripping mechanisms to securely transfer micro devices
Implementation Method 2
electrostatic or adhesive gripping mechanisms to securely transfer micro devices
Data Source
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AI summary
A transfer head array (110) includes a body (110) and a plurality of transfer heads (120). The body has a first surface, a second surface opposite to the first surface, and a plurality of recesses (111). The first surface has at least one chucking region and at least one interference avoidance region, and the recesses are separated from each other and are disposed in the interference avoidance region. The transfer heads are disposed on the chucking region.