Transfer Substrate Structure for Precise Nanorod LED Pixel Placement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in manufacturing display devices using LEDs is the high precision and difficulty in transferring nanorod-type semiconductor light emitting elements from a growing substrate to a base substrate, especially for micro displays with subminiature and high-density chip arrangements, due to the need for precise positioning and the complexity of the transfer process.
Innovation Solution
The solution involves a transfer substrate with a base substrate having circuit wiring and lower electrodes, where nanorod-type semiconductor light emitting elements are vertically arranged on the electrodes with non-flat contact surfaces formed by segmenting porous regions, allowing for high precision in positioning and simplifying the transfer process by omitting the need for separate alignment of elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If nanorod-type semiconductor light emitting elements are transferred from a growing substrate to a base substrate, then the display device can be manufactured with high precision positioning, but the transfer process becomes complex and difficult
Solution Approach 1:
The patent segments the nanorod-type semiconductor light emitting elements into multiple elements per pixel (e.g., three nanorods per pixel), allowing them to be transferred collectively as a group rather than individually. This segmentation approach enables high-precision positioning while simplifying the transfer process, as multiple elements can be handled together using the same transfer substrate structure.
Solution Approach 2:
The patent introduces a transfer substrate as an intermediary component between the growing substrate and the base substrate. The transfer substrate includes a transfer electrode that facilitates the transfer of nanorod elements, acting as a mediator that simplifies the transfer process while maintaining positioning precision. The transfer substrate structure enables controlled transfer without requiring complex direct manipulation between growing and base substrates.
2Manufacturing precision
If the size of LED chip is reduced for high-density arrangement, then the display device achieves higher resolution, but the transfer process requires higher precision and becomes more difficult
Solution Approach 1:
The patent divides each pixel into multiple nanorod-type semiconductor light emitting elements (e.g., three nanorods per pixel arranged in a triangular pattern). This segmentation allows for high-density chip arrangements while maintaining ease of manufacture, as the multiple small nanorods can be transferred collectively using the transfer substrate rather than requiring individual handling of each minute chip.
Solution Approach 2:
The patent transitions from planar chip arrangements to three-dimensional nanorod structures vertically arranged on the substrate. By arranging multiple nanorods in vertical and spatial configurations rather than simple planar layouts, the patent achieves high-density arrangements while the transfer substrate handles the complex positioning in multiple dimensions simultaneously, reducing transfer process difficulty.
3Reliability
If multiple nanorod-type semiconductor light emitting elements are arranged per pixel, then the display device achieves high image quality and tolerance to defects, but the structure becomes more complex
Solution Approach 1:
The patent segments each pixel into multiple nanorod-type semiconductor light emitting elements (typically three per pixel), where each nanorod can function independently. This segmentation provides reliability through redundancy - if one nanorod fails, others can compensate - while the transfer substrate manages the structural complexity by handling all nanorods as a coordinated group during the transfer process.
Solution Approach 2:
The patent merges multiple nanorod-type semiconductor light emitting elements into a single functional pixel unit, where the collective output of multiple nanorods forms one pixel. This merging approach achieves high reliability through multiple functional elements per pixel while the transfer substrate simplifies the overall structure by treating the group of nanorods as a single transfer unit, reducing the complexity of individual element management.
Data Source
AI summary
The present invention relates to a display device using a semiconductor light emitting element and a manufacturing method therefor. The display device comprises: a base substrate including a circuit wiring; a lower electrode part provided on the base substrate and connected to the circuit wiring; and a plurality of nanorod type semiconductor light emitting elements separated from each other and vertically arranged on the lower electrode part.