Transfer Substrate Layout for Single-Step Micro-LED RGB Alignment
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Solution Overview
Problem
Micro-LED displays face challenges in achieving exact alignment during the transfer process, particularly when using RGB LEDs, which increases the complexity and inefficiency of the transfer process.
Innovation Solution
A transfer substrate with semiconductor light emitting elements of different colors and a light conversion layer that converts one color into another, allowing all RGB LEDs to be transferred in a single process, with pixels arranged in a point-symmetrical format to enhance manufacturing efficiency and reduce the number of transfer actions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If separate transfer processes are used for each RGB LED, then alignment precision can be maintained, but transfer time and process complexity increase significantly
Solution Approach 1:
The patent combines multiple RGB LED transfer operations into a single unified transfer process. By integrating the transfer of red, green, and blue LEDs into one simultaneous operation, the patent reduces total transfer time while maintaining alignment precision through coordinated positioning mechanisms for all three colors.
Solution Approach 2:
The patent performs preliminary arrangement of RGB LEDs in their final positions on the transfer substrate before the actual transfer to the display device. This pre-positioning ensures that when the transfer occurs, all LEDs are already aligned correctly, eliminating the need for multiple separate transfer operations and reducing overall transfer time.
2Manufacturing precision
If multiple transfer actions are performed for RGB LEDs, then color alignment can be ensured, but manufacturing efficiency decreases
Solution Approach 1:
The patent merges the transfer actions for red, green, and blue LEDs into a single coordinated transfer operation. By transferring all three colors simultaneously in one action rather than sequentially, the patent maintains color alignment through integrated positioning while significantly improving manufacturing efficiency by reducing the number of transfer cycles required.
Solution Approach 2:
The transfer substrate is designed with universal functionality to hold and transfer all three RGB LED types in a single operation. The substrate incorporates positioning structures that can accommodate and align red, green, and blue LEDs simultaneously, enabling one transfer action to fulfill the function of multiple separate transfers and thereby improving productivity.
3Adaptability or versatility
If chip rotation is performed during transfer, then positioning flexibility increases, but fabrication complexity and potential misalignment increase
Solution Approach 1:
The patent employs asymmetric positioning structures on the transfer substrate that are designed to accommodate chips in a single fixed orientation. By creating an asymmetric interface between the chip and substrate with distinctive alignment features, the patent eliminates the need for rotation while maintaining positioning flexibility, thereby reducing fabrication complexity and potential misalignment issues.
Solution Approach 2:
Instead of allowing chip rotation to achieve positioning flexibility, the patent inverts the approach by designing the transfer substrate with built-in orientation guidance features. These features actively prevent rotation and guide the chip into the correct position, transforming the problem from managing rotational flexibility to ensuring rotational constraint, thereby simplifying the fabrication process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the transfer process by allowing all RGB LEDs to be transferred in one process, increases manufacturing efficiency, and ensures that color signals can be converted during operation without fabrication changes due to chip rotation, improving overall process efficiency.
Implementation Method 1
a light conversion layer formed on at least a portion of the semiconductor light emitting element to convert the first color into a second or third color
Data Source
AI summary
The present invention is applicable to display device-related technical fields and may provide a transfer substrate in which multiple semiconductor light-emitting elements of a first color and a light conversion layer formed on at least a portion of the semiconductor light-emitting elements to convert the first color into a second color or a third color are formed, the transfer substrate comprising: multiple unit pixels including one light-emitting element among the multiple semiconductor light-emitting elements; and a pixel including at least one of the multiple unit pixels, wherein the pixel includes a first pixel and a second pixel adjacent to each other and the light conversion layer of the unit pixel disposed at a position adjacent to the first pixel and the second pixel includes a light-emitting element which converts the first color into the same color.