Transformer-to-PCB Assembly Using Heat Sink Bus Bars
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional transformer assembly methods require thick copper foil layers on circuit boards to handle high current outputs, increasing manufacturing costs and complicating miniaturization and assembly, leading to yield issues in electrical equipment.
Innovation Solution
An assembly structure that uses a packaging chip with a built-in metal heat sink and conductive plates to connect the transformer's output electrodes directly to the circuit board, eliminating the need for additional copper foil layers and simplifying assembly with locking members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If thick copper foil layers are used on the circuit board to handle high current output from the transformer, then the current transmission capability is improved, but the manufacturing cost increases significantly
Solution Approach 1:
The patent extracts the high-current transmission function from the circuit board's copper foil layers and relocates it to a dedicated bus bar component. The bus bar is specifically designed to handle the high current output from the transformer, while the circuit board can use standard-thickness copper foil for other purposes, thereby reducing overall manufacturing cost while maintaining current transmission capability.
Solution Approach 2:
The patent segments the electrical connection system into two distinct parts: a bus bar for high-current transmission directly connected to the transformer, and the circuit board's patterned circuit for control signals and lower current paths. This segmentation allows each component to be optimized independently, with the bus bar using thick conductive material only where high current flows, reducing the total amount of expensive thick copper foil needed in the circuit board.
2Quantity of substance
If the number and thickness of copper foil layers are increased to withstand transformer current, then the current handling capability is improved, but the device complexity and assembly difficulty increase
Solution Approach 1:
The patent extracts the complex multi-layer copper foil structure from the circuit board and replaces it with a simpler bus bar component. The bus bar is a single, solid conductive element that is easier to manufacture and assemble than multiple thick copper foil layers, reducing assembly complexity while maintaining the same current handling capability.
3Ease of manufacture
If direct welding of transformer output terminal to circuit board is used, then the assembly process is simplified, but the yield is adversely affected due to assembly difficulties
Solution Approach 1:
The patent introduces a bus bar as an intermediary component between the transformer and the circuit board. The bus bar serves as a mediator that simplifies the connection process: the transformer connects to the bus bar (which has larger, easier-to-weld terminals), and the bus bar connects to the circuit board. This intermediary approach improves welding quality and assembly yield compared to direct transformer-to-circuit-board welding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution reduces manufacturing costs, stabilizes the assembly structure, and simplifies the assembly process by allowing direct current transmission from the transformer to the circuit board without the need for additional copper foil layers, enhancing the efficiency and reliability of electrical equipment.
Implementation Method 1
The first heat sink is connected to the packaging chip and the first conductive plate, is disposed on the circuit board, and is connected to the circuit board and the first conductive plate
Implementation Method 2
A metal heat sink built in a packaging chip disposed on the circuit board in combine with a conductive plate can be used as a conductive wire to connect the output electrode of the transformer and the patterned circuit of the circuit board
Data Source
AI summary
An assembly structure of a transformer and a circuit board includes: a circuit board, a packaging chip, a transformer, a first conductive plate, a second conductive plate and a first heat sink. The packaging chip is disposed on the circuit board. The transformer has at least one first output electrode and at least one second output electrode connected to the first output electrode. The first conductive plate is disposed on the transformer and connected to the at least one first output electrode. The second conductive plate is disposed on the transformer and connected to the at least one second output electrode and the circuit board. The first heat sink is connected to the packaging chip and the first conductive plate, is disposed on the circuit board, and is connected to the circuit board and the first conductive plate.