Transistor Testing Nest Alignment via Optical Imaging
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Solution Overview
Problem
Existing testing assemblies for transistor components under high current conditions often fail to ensure accurate positioning, leading to electrical contact issues and potential damage due to arcing, and wear down over time, resulting in unreliable connections.
Innovation Solution
A method and assembly that use image capture and alignment devices to precisely position transistor components within a testing nest, ensuring all electrical contacts make proper contact, and a pivotally mounted cover-plate mechanism to prevent over-penetration and maintain contact integrity, with cameras verifying contact alignment and adjusting the position as needed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the cover-plate is moved too close to the base-plate to establish electrical contact, then electrical connection is achieved, but the electrical contacts penetrate too far into the transistor component causing damage
Solution Approach 1:
The patent applies preliminary action by using image capture devices to capture images of the transistor component and electrical contacts before closing the nest. The alignment device then uses these pre-captured images to calculate and verify the precise positioning required to avoid over-penetration while ensuring reliable electrical contact. This preliminary imaging and calculation phase enables the cover-plate to be positioned accurately without causing damage.
Solution Approach 2:
The patent implements feedback by capturing images of the nest with the cover-plate closed using a camera, then using image processing to verify whether the electrical contacts have made proper contact with the transistor component. This feedback loop allows the system to detect and correct positioning errors, preventing both insufficient and excessive penetration of the electrical contacts into the component.
2Ease of operation
If the electrical contacts are moved to make contact after the component is delivered, then positioning flexibility is improved, but the risk of arcing damage increases due to incorrect positioning
Solution Approach 1:
The patent applies preliminary action by capturing images of the transistor component and electrical contacts before closing the nest. The alignment device uses these pre-captured images to calculate the precise positioning required, ensuring that when the cover-plate is moved to establish contact, the electrical contacts will align correctly with the transistor terminals. This eliminates the risk of arcing damage that would occur with incorrect positioning.
Solution Approach 2:
The patent replaces mechanical positioning methods with an optical imaging system. Instead of relying solely on mechanical alignment, the system uses image capture devices to record the positions of the transistor component and electrical contacts, then uses image processing algorithms to calculate and verify the correct positioning. This substitution of mechanical alignment with optical measurement and computational geometry ensures precise contact without arcing damage.
3Reliability
If the cover-plate is moved repeatedly to establish contact, then connection reliability is improved, but the electrical contacts wear down leading to connection failure
Solution Approach 1:
The patent applies preliminary action by capturing images of the electrical contacts and transistor component before closing the nest. This allows the alignment device to calculate and verify the precise positioning in advance, ensuring that the electrical contacts make proper contact on the first attempt without requiring repeated movement. By preventing positioning errors from the outset, the system avoids the wear and connection failures that would result from repeated adjustment of the cover-plate.
Data Source
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AI summary
A method of testing a transistor component, the method comprising the step of, (a) capturing a first image of the transistor component which is to be positioned into a nest for testing; (b) identifying from the first image the locations of the source and gate of the transistor component; (c) holding the transistor component using a component handling head on a rotatable turret, (d) using an alignment device to move the transistor component into a position on the component handling head such that the component handling head can deliver the component into a position on the nest wherein all of said plurality of electrical contacts on the base-plate of nest will make electrical contact with the drain of the transistor component, and a portion of the plurality of electrical contacts on the cover-plate of nest will make electrical contact with the gate of the transistor component and the remaining electrical contacts on the cover-plate of nest will make electrical contact with the source of the transistor component, when the cover is moved to close the nest; (e) delivering the transistor component to the nest so that all of said plurality of electrical contacts on the base-plate of nest make electrical contact with the drain of the transistor component; (f) moving the nest cover-plate to overlay the base-plate to close the nest and a portion of the plurality of electrical contacts on the cover-plate of nest will make electrical contact with the gate of the transistor component and the remaining electrical contacts on the cover-plate of nest will make electrical contact with the source of the transistor component; (g) performing testing of the transistor component. There is further provided a corresponding testing assembly.