Translucent-Sheet Bonding for Semiconductor Apparatuses with Graded-Cure Resin
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Solution Overview
Problem
The bonding reliability of a translucent sheet in semiconductor apparatuses is compromised due to increased internal stress from temperature changes and humidity, which can lead to cracks or breaks in the interface between the frame seal and the sealer.
Innovation Solution
A semiconductor apparatus design featuring a first bonding member with a lower cure ratio and elasticity modulus in the peripheral area and a second bonding member with a lower cure ratio in the effective pixel area, reducing stress concentration and improving bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the element substrate and translucent sheet are bonded together via frame seal and UV curable sealer, then the bonding structure is formed, but the bonding reliability decreases when internal stress increases due to heat expansion or swelling
Solution Approach 1:
The bonding structure is divided into two distinct parts: a frame seal positioned at the peripheral area and a UV curable sealer filled in the space surrounded by the frame seal. This segmentation allows each bonding member to perform its function independently, with the frame seal providing structural support at the edges and the sealer filling the internal space, thereby distributing and reducing stress concentration at any single interface.
Solution Approach 2:
Different bonding members are used in different areas of the element substrate. The frame seal is positioned at the peripheral area where structural support is needed, while the UV curable sealer is filled in the internal space where stress distribution is critical. This local differentiation optimizes the bonding reliability in each specific area according to its functional requirements.
2Strength
If a UV curable sealer is filled and cured in the space surrounded by the element substrate, translucent sheet, and frame seal, then the bonding is achieved, but cracks or breaks occur in the interface between frame seal and sealer under stress
Solution Approach 1:
The frame seal is installed beforehand to create a protective boundary structure before the UV curable sealer is filled. This pre-established frame seal acts as a cushioning element that absorbs and distributes stress, preventing the formation of cracks or breaks in the interface between the bonding members when internal stress increases due to thermal expansion or humidity-induced swelling.
3Ease of manufacture
If the frame seal and sealer are in contact to form a bonding structure, then the packaging is complete, but the interface becomes vulnerable to stress concentration
Solution Approach 1:
The UV curable sealer acts as an intermediary material that fills the space between the frame seal and the translucent sheet. This intermediary substance provides a bonding interface that distributes stress evenly across the contact area, preventing stress concentration at sharp corners or direct rigid contacts between the frame seal and translucent sheet, thereby improving interface reliability while maintaining packaging completeness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the occurrence of cracks and breaks in the interface, enhancing the bonding reliability of the translucent sheet and maintaining the quality of display and image pickup performance.
Implementation Method 1
the sealer is cured by irradiating the sealer with light (UV) via the translucent sheet
Data Source
AI summary
A semiconductor apparatus includes a translucent sheet and a semiconductor device that includes an effective pixel area and a peripheral area. A first bonding member is disposed between the peripheral area and the translucent sheet. A second bonding member is disposed between the effective pixel area and the translucent sheet. The first bonding member and the second bonding member are in contact with each other via a first interface. The second bonding member is made of a resin. The second bonding member includes a first part, and a second part disposed between the first part and the first bonding member and in contact with the first bonding member via the first interface. A cure ratio of the second part is lower than a cure ratio of the first part.