Transmissive Illumination for Semiconductor Height and Surface Testing
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Solution Overview
Problem
Current semiconductor chip testing methods require separate units for measuring mount height and detecting surface particles, leading to increased cost, complexity, and time in the manufacturing process.
Innovation Solution
An apparatus and method using a transmissive illuminating unit with a light source and a transmissive mask pattern to project measuring light onto the chip, allowing a single unit to detect both the height and surface state of semiconductor chips by analyzing reflected light, with a moving unit to position the chip and a detecting unit to process the reflected light for height and surface analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate testing units are used for measuring mount height and detecting surface particles, then measurement precision for each parameter is improved, but device complexity and cost increase
Solution Approach 1:
The patent combines mount height measurement and surface particle detection functions into a single integrated testing unit. The illumination unit projects light through a mask pattern onto the semiconductor chip, and the detection unit captures reflected light to simultaneously determine both mount height (via focus position analysis) and surface particles (via image analysis), eliminating the need for separate testing units while maintaining measurement precision
Solution Approach 2:
The testing unit is designed with multi-functionality to perform both mount height measurement and surface particle detection using the same hardware components. The illumination system with mask pattern and the detection unit with image processor can analyze different aspects of the reflected light to extract multiple parameters (height and surface defects) from a single measurement setup
2Measurement precision
If separate testing units are used for measuring mount height and detecting surface particles, then measurement accuracy is maintained, but manufacturing cost increases
Solution Approach 1:
The patent merges surface particle detection and mount height measurement into one testing unit, reducing the total number of devices required in the manufacturing line. This consolidation lowers equipment investment costs, installation space requirements, and maintenance expenses while preserving detection accuracy through sophisticated image processing algorithms that analyze reflected light patterns
3Reliability
If separate testing units are used for measuring mount height and detecting surface particles, then each test can be performed independently, but measurement time increases
Solution Approach 1:
The testing unit performs mount height measurement and surface particle detection simultaneously in a continuous process. The illumination unit continuously projects light onto the moving semiconductor chip, and the detection unit continuously captures reflected light, allowing both measurements to be completed in one pass without sequential testing, thereby increasing productivity while maintaining reliable results
Solution Approach 2:
The patent uses a mask pattern with multiple regions (first region for height measurement, second region for surface detection) arranged in different spatial dimensions. This allows the system to extract multiple types of information from the reflected light in different dimensional aspects, enabling simultaneous measurement of height and surface particles without interfering with each other's reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables simultaneous measurement of semiconductor chip height and surface state using a single apparatus, reducing measurement time and eliminating the need for multiple testing units, thus simplifying and cost-effectively integrating these tests into the manufacturing process.
Implementation Method 1
a light source generating light
Implementation Method 2
a first region configured to convert the light generated from the light source into a slit light
Implementation Method 3
A detecting unit is configured to receive a reflected light of the measuring light from the object
Data Source
AI summary
An apparatus for testing an object includes a moving unit configured to hold and move the object. A transmissive illuminating unit includes a light source generating light and a transmissive mask pattern. The transmissive mask pattern includes a first region configured to convert the light generated from the light source into a slit light, and a second region arranged in a movement direction of the object with respect to the first region to partially transmit the light generated from the light source. The transmissive illuminating unit is configured to project a measuring light, which is provided by transmitting the light generated from the light source through the transmissive mask pattern, to the object. A detecting unit is configured to receive a reflected light of the measuring light from the object and to detect a height and surface state of the object based on the reflected light.