Transmissive Target Carbide Buffer for Diamond Substrate Adhesion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing X-ray generating apparatuses face issues with maintaining stable adhesion between the target layer and the diamond substrate, leading to variations in X-ray output due to thermal stress caused by mismatched linear expansion coefficients, which affects the durability and reliability of the transmissive targets.
Innovation Solution
A transmissive target structure is implemented with a target layer and a diamond substrate, where carbide regions and non-carbide regions are alternately disposed on the boundary surface to reduce thermal stress, using carbide of the target metal to enhance anchoring and compatibility, and maintaining a specific thickness and distribution of carbide regions to ensure stable adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a transmissive target with diamond substrate is used to improve heat dissipation, then heat resistance is improved, but adhesion property deteriorates due to thermal stress from linear expansion coefficient mismatch
Solution Approach 1:
A buffer layer is introduced between the diamond substrate and the target layer to act as an intermediary that accommodates the linear expansion coefficient mismatch. This buffer layer absorbs thermal stress during heating and cooling cycles, preventing direct stress transmission that would cause delamination, thus maintaining both heat dissipation performance and adhesion reliability.
Solution Approach 2:
The target structure employs a composite material system consisting of diamond substrate, buffer layer, and target layer. Each material is selected for its specific properties: diamond for thermal conductivity, buffer layer for mechanical compatibility, and target layer for X-ray generation. This composite structure optimizes both thermal management and structural integrity.
2Productivity
If target layer thickness is reduced to improve X-ray transmission, then X-ray generating efficiency is improved, but mechanical strength and adhesion stability worsen
Solution Approach 1:
The composite structure with buffer layer provides mechanical reinforcement to the thin target layer, enabling it to maintain structural integrity and adhesion stability even at reduced thicknesses that optimize X-ray transmission while preventing mechanical failure.
3Temperature
If diamond substrate is used to improve thermal conductivity, then heat dissipation is improved, but compatibility with target metal worsens due to low wettability and linear expansion mismatch
Solution Approach 1:
The buffer layer serves as a mediator between the diamond substrate and target metal, addressing both wettability and linear expansion coefficient mismatches. This intermediate layer improves interfacial bonding while accommodating thermal expansion differences, enabling effective thermal conduction without compromising material compatibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses variations in X-ray output intensity, ensuring stable and reliable X-ray generation over a long period by reducing thermal stress and improving adhesion between the target layer and the diamond substrate.
Implementation Method 1
thermal stress caused by mismatched linear expansion coefficients
Implementation Method 2
target layer configured to include target metal and generate X-ray when receiving irradiated electrons
Implementation Method 3
diamond substrate which allows X-ray to be transmitted and which supports the target layer
Data Source
AI summary
A transmissive target includes a target layer configured to include target metal and generate X-ray when receiving electrons and a substrate configured to support the target layer and include carbon as a main component. A carbide region including carbide of the target metal and a non-carbide region including the target metal are disposed in a mixed manner on a boundary surface between the substrate and the target layer on a target layer side.