Transparent Conductive Film Pattern for LCD Delamination Prevention
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Solution Overview
Problem
Delamination issues with upper layer insulation films on transparent conductive films in liquid crystal display apparatuses, particularly in areas with low pattern density, lead to reduced yield and reliability, and increased risk of corrosion and dust contamination in manufacturing.
Innovation Solution
A thin film transistor array substrate design where the transparent conductive film pattern is configured such that it does not cover the end faces of electrode patterns, with a first-type pattern overlapping and a second-type pattern sticking out to cover these ends, reducing stress concentration and preventing delamination, and using a two-layer transparent conductive film structure to protect exposed edges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the transparent conductive film pattern is formed to cover the end faces of electrode patterns to improve protection and insulation, then the reliability is improved, but the delamination of upper layer insulation film is caused due to stress concentration at the edges
Solution Approach 1:
The transparent conductive film pattern is segmented into two types: first-type patterns that are located within electrode patterns and do not cover end faces, and second-type patterns that stick out from electrode patterns and cover end faces. This segmentation allows different regions to serve different functions - the first-type patterns provide protection in areas where delamination risk is low, while the second-type patterns provide edge coverage in areas where protection is critical, thereby balancing protection needs with delamination prevention.
Solution Approach 2:
Different transparency and coverage characteristics are applied to different locations. The second-type transparent conductive film patterns have extended regions that cover the end faces of electrode patterns, providing enhanced protection and insulation at critical edge locations. Meanwhile, the first-type patterns maintain standard coverage within electrode patterns, avoiding stress concentration. This local differentiation optimizes both protection and delamination prevention.
2Illumination intensity
If the upper layer insulation film is formed with high transmittance conditions to improve display brightness, then the transmittance is improved, but the delamination is caused due to insufficient stress balance
Solution Approach 1:
The transparent conductive film pattern is pre-configured with second-type patterns that extend to cover the end faces of electrode patterns before the upper layer insulation film is formed. This preliminary action creates a stress-distributing structure that prevents delamination during subsequent insulation film formation, allowing high transmittance conditions to be used without causing delamination issues.
Solution Approach 2:
The transparent conductive film pattern acts as an intermediary structure between the substrate and the upper layer insulation film. By extending second-type patterns to cover end faces, it provides a transition zone that mediates stress distribution, preventing direct stress concentration at the insulation film edges and enabling high transmittance formation conditions without delamination.
3Object-affected harmful factors
If the transparent conductive film pattern covers the end faces of electrode patterns to prevent corrosion, then the protection is improved, but the delamination occurs and causes dust contamination in manufacturing
Solution Approach 1:
The transparent conductive film pattern is divided into first-type patterns (within electrode patterns) and second-type patterns (extending to cover end faces). This segmentation provides corrosion protection at critical edge locations through second-type patterns while maintaining overall pattern stability to prevent delamination and dust generation during manufacturing processes.
Solution Approach 2:
Extended coverage is applied locally at the end faces of electrode patterns using second-type transparent conductive film patterns, providing targeted corrosion protection where it is most needed. The rest of the electrode patterns use first-type patterns with standard coverage, maintaining stress balance and preventing delamination that would lead to dust contamination.
Data Source
AI summary
A thin film transistor array substrate of the present invention having an array area, and a frame area, the thin film transistor array substrate includes: a thin film transistor; an upper metal pattern formed by the same material as source and drain electrodes at the same layer; a transparent conductive film pattern; and an upper layer insulation film, wherein the transparent conductive film pattern has: a first-type transparent conductive film pattern provided to located within one of a pattern of the electrode pattern and a pattern of the metal pattern, as viewed from the top side, and to not cover pattern end faces of the electrode pattern or the metal pattern; and a second-type transparent conductive film pattern provided to stick out from an inside of at least a portion of one of the patterns, as viewed from the top side and to cover the pattern end faces.