Transparent Conductive Interconnect Lines for Pixel Cell Light Focusing

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Solution Overview

Problem

Conventional imaging devices face limitations due to the presence of opaque metal interconnect lines, which interfere with light paths and reduce image quality by reflecting photons and requiring complex routing to avoid intersections with photosensors.

Innovation Solution

The use of transparent conductive materials for interconnect lines that also function as microlenses or color filters, allowing for light transmission and simplifying conductor routing while maintaining electrical connectivity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If opaque metal interconnect lines are used, then electrical connectivity is achieved, but light transmission is blocked and image quality deteriorates

Engineering Contradiction:
Improveelectrical connectivityVSAvoidlight interference
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent changes the optical parameter (transparency) of the interconnect lines by using transparent conductive materials such as ITO (indium tin oxide) instead of traditional opaque metals. This allows the interconnect lines to maintain electrical conductivity while becoming transparent to light, thereby eliminating light interference and improving image quality.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite material structures where transparent conductive materials are combined with dielectric layers to form interconnect lines that possess both electrical conductivity and optical transparency. This composite approach enables the interconnect structure to simultaneously achieve electrical connectivity and light transmission.

Inventive Principle:
Principle #40Composite materials

2Reliability

If opaque metal interconnect lines are used, then electrical connectivity is achieved, but complex routing is required to avoid intersections with photosensors

Engineering Contradiction:
Improveelectrical connectivityVSAvoidrouting complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent makes the interconnect lines multi-functional by giving them both electrical conductivity and optical transparency. This allows the same interconnect structure to serve dual purposes: providing electrical connectivity and allowing light transmission, thereby eliminating the need for complex routing arrangements to avoid photosensor intersections.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Illumination intensity

If transparent conductive materials are used for interconnect lines, then light transmission is improved, but manufacturing complexity increases

Engineering Contradiction:
Improvelight transmissionVSAvoidfabrication complexity
Core Design Contradiction:
Illumination intensityVSEase of manufacture

Solution Approach 1:

The patent changes the material parameter from traditional metals to transparent conductive materials like ITO. While this improves light transmission, it requires modifications to the fabrication process including specific deposition techniques and pattern formation methods, thereby increasing manufacturing complexity.

Inventive Principle:
Principle #35Parameter changes

4Device complexity

If transparent conductive materials serve dual functions as interconnect lines and microlenses, then device complexity is reduced, but material performance requirements increase

Engineering Contradiction:
Improvestructure complexityVSAvoidmaterial performance
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent designs the transparent conductive interconnect lines to perform multiple functions simultaneously: electrical connectivity, light transmission, and microlens functionality for light focusing. This multi-functionality reduces overall device complexity by eliminating separate components, but imposes stringent requirements on the material's optical and electrical properties.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent applies local quality by varying the shape and cross-sectional profile of the transparent conductive interconnect lines. By forming them with specific curved profiles, the same material structure serves as both electrical conductor and optical microlens, with different regions of the structure performing different functions.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances image capture quality by allowing transparent conductive materials to serve dual functions, reducing production costs and simplifying fabrication, while avoiding light interference and improving image quality.

Implementation Method 1

transparent conductive materials for interconnect lines that also function as microlenses or color filters, allowing for light transmission

Methodology Applied
Scientific EffectLight transmission: Light

Implementation Method 2

transparent conductive material is configured and arranged to act as a microlens, while in others it is configured and arranged to act as a color filter

Methodology Applied
Scientific EffectLight focusing: Focusing

Implementation Method 3

transparent conductive material is configured and arranged to act as a microlens, while in others it is configured and arranged to act as a color filter

Methodology Applied
Scientific EffectColor filtering: Filter (optical)

Data Source

PatentUS7829361B2Methods for making a pixel cell with a transparent conductive interconnect line for focusing light
Publication Date: 2010.11.09 APTINA IMAGING CORP
  • US7829361B2 patent drawing
  • US7829361B2 patent drawing
  • US7829361B2 patent drawing

AI summary

The invention relates to an imaging device having a pixel cell with a transparent conductive material interconnect line for focusing incident light onto a photosensor and providing an electrical connection to pixel circuitry, and the method of making the same.