Transparent LED Package with Multi-Wavelength Quantum Wells

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The challenge in the field of light-emitting diode (LED) packaging is to enhance yield and thinning while maintaining effective light emission, particularly with the use of transparent substrates and multiple quantum well structures that emit different wavelengths.

Innovation Solution

A light-emitting diode package is designed with a transparent substrate, featuring multiple quantum well structures for LEDs that emit lights of different wavelengths, along with conductive pads and an adhesive layer for secure attachment, and optional anti-reflection and light shielding layers to improve transmittance and reduce external light interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple quantum well structures with different wavelengths are integrated on a transparent substrate, then the functionality and versatility of the LED package is improved, but the device complexity increases

Engineering Contradiction:

Improvemulti-wavelength emission capabilityVSAvoidpackage structure complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple quantum well structures with different wavelengths (e.g., blue, green, red LEDs) onto a single transparent substrate, merging multiple light-emitting functions into one integrated package. This allows the LED package to emit multiple wavelengths simultaneously or selectively, enhancing versatility while managing complexity through unified substrate integration

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The transparent substrate serves multiple functions: it acts as a mechanical support for mounting multiple LEDs, provides optical transparency for light extraction, and enables the package to function as a multi-wavelength light source. This multi-functionality reduces the need for separate components and simplifies the overall system architecture

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Illumination intensity

If a transparent substrate is used to improve light transmittance, then the optical performance is improved, but the structural strength may be reduced

Engineering Contradiction:

Improvelight transmittanceVSAvoidsubstrate mechanical strength

Core Design Contradiction:

Illumination intensityVSStrength

Solution Approach 1:

The patent employs composite material structures where the transparent substrate is combined with support elements, adhesive layers, and encapsulation materials. This composite approach maintains high light transmittance while compensating for the reduced mechanical strength of transparent materials through the reinforcing effect of other materials in the composite structure

Inventive Principle:

Principle #40Composite materials

3Length of moving object

If the LED package is thinned to improve integration, then the thickness is reduced, but the manufacturing precision requirements increase

Engineering Contradiction:

Improvepackage thicknessVSAvoidalignment precision

Core Design Contradiction:

Length of moving objectVSManufacturing precision

Solution Approach 1:

The patent incorporates preliminary alignment features such as pre-formed conductive pads, alignment marks, and positioning structures on the substrate before mounting the LEDs. These preliminary actions establish precise reference points that guide subsequent assembly steps, ensuring accurate alignment even in thinned packages where tolerance margins are reduced

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the yield and thinning of LED packages by ensuring efficient light emission with high transmittance and reduced ambient light interference, improving the quality and contrast of electronic devices using these packages.

Implementation Method 1

a first light-emitting diode which is disposed on the transparent substrate and has a first multiple quantum well structure. The light-emitting diode package further includes a second light-emitting diode which is disposed on the transparent substrate and has a second multiple quantum well structure. The first multiple quantum well structure and the second multiple quantum well structure are configured to emit lights with different wavelengths.

Methodology Applied

Scientific EffectElectroluminescence: Electroluminescence

Implementation Method 2

A light-emitting diode package is designed with a transparent substrate, featuring multiple quantum well structures for LEDs that emit lights of different wavelengths

Methodology Applied

Scientific EffectLight transmission: Refraction

Data Source

PatentUS11322646B2Light-emitting diode package and electronic device

Publication Date: 2022.05.03 INNOLUX CORP

AI summary

Some embodiments of the present disclosure provide a light-emitting diode package. The light-emitting diode package includes a transparent substrate. The light-emitting diode package also includes a first light-emitting diode which is disposed on the transparent substrate and has a first multiple quantum well structure. The light-emitting diode package further includes a second light-emitting diode which is disposed on the transparent substrate and has a second multiple quantum well structure. The first multiple quantum well structure and the second multiple quantum well structure are disposed to emit lights with different wavelengths.