Transparent LED Light Sheet With Single-Sided Wiring
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Solution Overview
Problem
Conventional light emitting diode (LED) packages are bulky and costly, limiting their application in compact and cost-effective illumination or advertising solutions that require transparent or decorative light emission.
Innovation Solution
A sandwich-type light emitting device using unpackaged light emitting diode chips between a transparent substrate and an opposite substrate, where the chips are electrically connected to a wiring layer on the transparent substrate but not on the opposite substrate, allowing light to pass through for illumination or advertising purposes, and enabling a thinner, more cost-effective design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional LED packages are used, then reliable light emission is achieved, but the device becomes bulky and costly
Solution Approach 1:
The conventional packaged LED is segmented into its core functional component - the LED chip - which is then directly mounted on the transparent substrate without the bulky packaging structure. This segmentation allows retaining the light-emitting function while eliminating the volume-consuming package housing, leading to a thinner and more compact device configuration.
Solution Approach 2:
The packaging structure is extracted and removed from the LED chip in this invention. By taking out the unnecessary package housing and directly mounting the LED chip on the transparent substrate, the device achieves reduced volume and lower cost while maintaining the essential light-emitting reliability through proper chip mounting and electrical connection.
2Reliability
If conventional LED packages are used, then reliable light emission is achieved, but manufacturing cost increases
Solution Approach 1:
The expensive package housing and complex packaging processes are extracted and removed from the LED structure. By using bare LED chips directly mounted on the substrate with simplified bonding and wiring, the manufacturing cost is significantly reduced while the essential light-emitting reliability is maintained through proper chip selection and mounting techniques.
Solution Approach 2:
The invention replaces expensive, complex packaged LED modules with simpler, cheaper bare LED chips that can be directly mounted. This substitution uses more economical components and manufacturing processes, reducing overall device cost while achieving the required light emission performance for the application.
3Reliability
If wiring layer is disposed on both substrates, then electrical connection is improved, but device complexity and alignment precision requirements increase
Solution Approach 1:
The wiring layer is extracted from the opposite substrate and consolidated only on the transparent substrate in this invention. This simplification removes the complexity of dual-sided wiring and alignment requirements, reducing device structural complexity while maintaining reliable electrical connections through the simplified single-substrate wiring approach combined with proper chip bonding.
4Reliability
If wiring layer is disposed on both substrates, then electrical connection is improved, but manufacturing precision requirements increase
Solution Approach 1:
The wiring layer configuration is simplified by extracting it from the opposite substrate and placing it only on the transparent substrate. This elimination of dual-sided wiring removes the need for precise alignment between two substrates during assembly, significantly reducing manufacturing precision requirements while maintaining reliable electrical connections through the simplified structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces manufacturing costs and allows for a thinner, transparent light emitting device that can be used as a decorative or illuminative transparent board, suitable for various applications without the need for precise substrate alignment, enhancing mass production feasibility and light-emitting efficiency.
Implementation Method 1
a plurality of light emitting diode chips disposed on the transparent substrate and electrically connected to the wiring layer
Data Source
AI summary
An embodiment of the present invention provides a light emitting device including: a transparent substrate; a wiring layer disposed on the transparent substrate; a plurality of light emitting diode chips disposed on the transparent substrate and electrically connected to the wiring layer; and an opposite substrate disposed on the transparent substrate to sandwich the light emitting diode chips and the wiring layer, wherein no wiring layer is disposed on a surface of the opposite substrate facing the light emitting diode chips.