Transparent Substrate Image Sensor Package with Conductive Posts
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Solution Overview
Problem
Conventional image sensor chip package structures are bulky and thick due to the use of wire bonding, which limits their miniaturization and integration in digital image processing devices.
Innovation Solution
The image sensor chip package structure employs a transparent substrate with through holes and conductive posts, where the chip is directly bonded to the substrate using conductive bumps, eliminating the need for wire bonding and reducing the overall volume and thickness by forming a Chip Size Package (CSP).
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wire bonding is used to electrically connect the image sensor chip to the substrate, then reliable electrical connection is achieved, but the package volume and thickness increase
Solution Approach 1:
The patent extracts and eliminates the wire bonding process from the packaging structure. Instead of using separate wires to connect the chip to the substrate, the invention directly integrates electrical connection through conductive pads and bonding wires that are part of the substrate structure itself, thereby removing the need for additional wire bonding components and reducing overall package volume.
Solution Approach 2:
The invention merges the electrical connection function with the substrate structure. The conductive pads and bonding wires are integrated into the substrate design, combining what were previously separate functions (substrate support and electrical connection) into a unified structure, eliminating the need for separate wire bonding operations and reducing package thickness.
2Reliability
If wire bonding is used to electrically connect the image sensor chip to the substrate, then electrical connection is established, but the package thickness increases
Solution Approach 1:
The patent removes the wire bonding step from the packaging process. The electrical connection is achieved through direct contact between chip pads and substrate conductive pads via bonding wires that are part of the substrate, eliminating the need for additional wire bonding layers and reducing package thickness.
Solution Approach 2:
The invention changes the dimensional approach to electrical connection by using conductive pads that extend vertically from the substrate surface, allowing direct vertical connection to the chip pads. This eliminates the need for horizontal wire bonding paths and reduces the overall thickness of the package structure.
3Reliability
If conventional CLCC technology with ceramic base and glass cover plate is used, then the image sensor chip is protected in a sealed space, but the package volume increases
Solution Approach 1:
The invention merges the protective encapsulation function with the substrate structure itself. The transparent substrate serves both as the mounting platform and as the protective seal, eliminating the need for separate ceramic bases and glass cover plates. This integration maintains chip protection while significantly reducing package volume.
Solution Approach 2:
The patent uses a thin transparent substrate that provides both structural support and protective sealing. This thin-film approach replaces the bulky ceramic and glass multi-layer structure with a single thin transparent layer that maintains protection while reducing overall package volume and enabling miniaturization.
4Reliability
If conventional CLCC technology with ceramic base and glass cover plate is used, then the image sensor chip is protected, but the package structure becomes complex
Solution Approach 1:
The invention combines multiple functions into a single integrated substrate structure. The transparent substrate simultaneously provides chip mounting, electrical connection through conductive pads, and protective sealing, eliminating the need for separate ceramic base, glass cover plate, and wire bonding components. This integration dramatically simplifies the overall package structure while maintaining protection.
Solution Approach 2:
The patent extracts and removes the complex multi-component CLCC structure (ceramic base, glass cover plate, separate wire bonding) and replaces it with a simplified single-substrate structure that performs all necessary functions, thereby reducing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces the space required for signal transmission, simplifies circuit layouts, and decreases the package's volume and thickness, enabling more compact and efficient image sensor designs.
Implementation Method 1
The conductive bumps are respectively disposed on the die pads and respectively connected with the conductive posts
Implementation Method 2
a sputtering process and an electroplating process are performed through the conductive layer for forming the conductive posts
Implementation Method 3
a sputtering process and an electroplating process are performed through the conductive layer for forming the conductive posts
Data Source
AI summary
An image sensor chip package structure includes a transparent substrate, a chip, a sealing ring, a number of conductive posts, and a number of conductive bumps. The transparent substrate has a number of through holes. The through holes pass through the transparent substrate. The chip has an active surface, an image sensitive area, and a number of die pads. The image sensitive area and the die pads are located on the active surface. The sealing ring is disposed between the chip and the transparent substrate and surrounds the image sensitive area and the die pads. The conductive posts are disposed in the through holes, respectively. Here, the chip is electrically connected with the conductive posts via the die pads. The conductive bumps are disposed on the die pads, respectively. The conductive bumps are connected with the conductive posts, respectively.