Transverse Bulk Acoustic Wave Filter Micro-Transfer Integration
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Solution Overview
Problem
Existing acoustic wave filters in electronic circuits are limited by size, weight, and integration, requiring improved integration and performance, especially in mobile telecommunications systems where high operating frequencies are necessary.
Innovation Solution
A compound acoustic wave filter device is created by micro-transfer printing a piezoelectric filter element and electrodes onto a semiconductor substrate, reducing device size, noise, and increasing integration, using a semiconductor substrate with an active electronic circuit and an adhesive layer to connect electrodes, allowing for surface or bulk acoustic wave filtering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional electromechanical filters are used in electronic circuits, then filtering performance is achieved, but device size and weight increase
Solution Approach 1:
The patent combines the acoustic wave filter with the semiconductor substrate into a single integrated device. The filter element is formed directly on the substrate, eliminating the need for separate filter components and their supporting structures, thereby reducing overall device weight while maintaining filtering performance.
Solution Approach 2:
The filter element is nested within the semiconductor substrate structure. The piezoelectric layer and electrode structures are embedded within or on the substrate, creating a compact nested configuration that reduces weight compared to traditional discrete filter assemblies.
2Reliability
If traditional acoustic wave filters are used, then filtering functionality is provided, but device integration is reduced
Solution Approach 1:
The filter element is merged with the semiconductor substrate to form a single integrated device. The piezoelectric layer, electrodes, and substrate work together as one unified structure, eliminating the need for separate filter components and interconnections, thereby improving integration.
Solution Approach 2:
The filter element is segmented into distinct functional layers (piezoelectric layer, input electrode, output electrode) that can be independently designed and optimized while maintaining overall integration with the substrate. This segmentation allows for functional independence within the integrated structure.
3Reliability
If separate packaged devices are used, then individual filter operations are achieved, but device size increases
Solution Approach 1:
Multiple filter elements can be integrated on a single substrate, allowing multiple filter operations to be performed within one compact device. This eliminates the need for multiple separate packaged devices, reducing overall device volume while maintaining individual filter functionalities.
Solution Approach 2:
Multiple filter elements are nested on the same substrate, with each element occupying a distinct region. This nested arrangement allows multiple filter operations to coexist in a compact configuration, significantly reducing the volume compared to separate packaged devices.
4Volume of moving object
If micro-transfer printing is used to integrate the filter, then device size is reduced, but manufacturing complexity increases
Solution Approach 1:
The filter element is preliminarily formed on a separate sacrificial layer or template substrate before being transferred to the final semiconductor substrate. This preliminary formation allows for optimized fabrication processes and ensures proper alignment and integration, making the overall manufacturing more manageable despite the additional transfer step.
Solution Approach 2:
A sacrificial layer or template substrate serves as an intermediary during the manufacturing process. The filter element is first created on this intermediary substrate, then transferred to the final device substrate. This intermediary approach simplifies the manufacturing by separating the filter fabrication from the device assembly, making both steps more controllable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in a highly integrated, smaller, and more cost-effective acoustic wave filter device with improved performance, capable of handling high operating frequencies, and enabling multiple filter operations within a single packaged device.
Implementation Method 1
An acoustic wave filter includes a piezoelectric filter element and two or more electrodes
Implementation Method 2
A left acoustic mirror is in contact with the left side and a right acoustic mirror is in contact with the right side
Implementation Method 3
resonant crystalline material
Data Source
AI summary
A micro-transfer printable transverse bulk acoustic wave filter comprises a piezoelectric filter element having a top side, a bottom side, a left side, and a right side disposed over a sacrificial portion on a source substrate. A top electrode is in contact with the top side and a bottom electrode is in contact with the bottom side. A left acoustic mirror is in contact with the left side and a right acoustic mirror is in contact with the right side. The thickness of the transverse bulk acoustic wave filter is substantially less than its length or width and its length can be greater than its width. The transverse bulk acoustic wave filter can be disposed on, and electrically connected to, a semiconductor substrate comprising an electronic circuit to control the transverse bulk acoustic wave filter and form a composite heterogeneous device that can be micro-transfer printed.