Trapezoidal Substrate Vias for Semiconductor Heat Removal
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Solution Overview
Problem
Existing semiconductor packaging technologies face inefficiencies in heat dissipation due to high thermal resistance in the thermal path from the die through the multi-layer circuit board (MLB), limiting the effective removal of heat from semiconductor devices.
Innovation Solution
The use of a trapezoidal-shaped via structure with successively increasing cross-sectional areas, fabricated using thermally conductive materials like copper, silver, or aluminum, to enhance heat dissipation by providing a more efficient thermal path from the semiconductor die to the substrate, thereby reducing thermal resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional via structures (barrel or filled) are used, then the MLB provides electrical connections and some heat dissipation, but the thermal resistance of the thermal path from the die through the MLB is unacceptably high
Solution Approach 1:
The via structure is segmented into multiple sections with progressively increasing cross-sectional areas, creating a stepped configuration that divides the heat conduction path into segments of varying thermal resistance, thereby improving overall heat dissipation efficiency
Solution Approach 2:
The via structure transitions from a conventional uniform cross-section to a multi-dimensional stepped configuration with varying cross-sectional areas, adding geometric complexity in the vertical dimension to optimize thermal conduction while maintaining electrical connectivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves thermal dissipation efficiency, leading to enhanced thermal performance and consistent electrical performance of semiconductor devices by allowing heat to flow effectively through the trapezoidal-shaped via structure.
Implementation Method 1
The use of a trapezoidal-shaped via structure with successively increasing cross-sectional areas, fabricated using thermally conductive materials like copper, silver, or aluminum, to enhance heat dissipation by providing a more efficient thermal path from the semiconductor die to the substrate
Data Source
AI summary
A substrate comprising a plurality of layers, a first side and a second side; and a via extending through the substrate from the first side to the second side. The via comprises:a first substrate via extending through a first layer of the plurality of layers, the first substrate via having a first cross-sectional area; a first capture pad disposed under the first substrate via, wherein the first capture pad physically contacts the first substrate via; a second substrate via extending through a second layer of the plurality of layers, the second substrate via physically contacting the first capture pad, the second substrate via having a second cross-sectional area that is greater than the first cross-sectional area; and a second thermal and electrical contact pad disposed under the second dielectric layer, wherein the second contact pad physically contacts the second substrate via.