Treating Agent Materials for Organosilicate Glass Dielectric Films
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Low dielectric constant materials used in semiconductor devices suffer damage during etching and ashing processes, leading to increased dielectric constant, void formation, and reduced hydrophobicity, which affects the performance and reliability of integrated circuits.
Innovation Solution
A treating agent composition comprising a silane-based monomer with reactive leaving groups, an activating agent, and a solvent mixture is applied to restore hydrophobicity and carbon content in organosilicate glass dielectric films, preventing void formation and improving mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If etching and ashing processes are used to pattern dielectric films, then device fabrication is enabled, but carbon depletion and damage occur leading to increased dielectric constant and reduced hydrophobicity
Solution Approach 1:
The patent applies a treating agent composition containing silane-based monomers with reactive leaving groups before the dielectric film undergoes damage during etching and ashing. This preliminary treatment prepares the film surface to resist carbon depletion and maintain hydrophobicity, preventing damage rather than correcting it afterward
Solution Approach 2:
The treating agent composition acts as an intermediary substance that mediates between the dielectric film and the harsh etching/ashing environment. The silane-based monomers form a protective layer on the film surface, shielding it from carbon depletion while allowing the patterning process to proceed
2Reliability
If carbon is added to reduce dielectric constant, then lower k value is achieved, but hydrophobicity is reduced and the film becomes more susceptible to damage
Solution Approach 1:
The patent changes the chemical parameters of the dielectric film surface by applying silane-based monomers that react with surface silanol groups. This transformation modifies the surface chemistry to restore hydrophobicity and carbon content while maintaining the low bulk dielectric constant, effectively decoupling these two properties
Solution Approach 2:
The treating agent composition selectively modifies the surface properties of the dielectric film without changing the bulk composition. The silane-based monomers concentrate at the film surface where they react with silanol groups to restore hydrophobicity, while the low-k bulk material remains intact
3Device complexity
If conventional etch and ash processes are used, then manufacturing simplicity is maintained, but significant damage occurs causing fluorine addition and carbon depletion
Solution Approach 1:
The treating agent composition serves as a protective intermediary that allows conventional etch and ash processes to be used without modification. The silane-based monomers form a protective layer that shields the dielectric film from fluorine addition and carbon depletion during the standard manufacturing process
Solution Approach 2:
The patent applies the treating agent composition beforehand to cushion or buffer the dielectric film against the harmful effects of conventional etching and ashing. The silane-based monomers create a protective barrier that absorbs or mitigates the damage that would otherwise occur during standard manufacturing processes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The treatment effectively reduces dielectric constant, enhances hydrophobicity, and improves the resistance of low-k materials to further damage, ensuring stable performance and yield in semiconductor manufacturing.
Implementation Method 1
a component capable of alkylating or arylating silanol moieties of the organosilicate glass dielectric film via silylation
Implementation Method 2
an activating agent which may be an acid, a base, an onium compound, a dehydrating agent
Data Source
AI summary
A treating agent composition for increasing the hydrophobicity of an organosilicate glass dielectric film when applied to said film. It includes a component capable of alkylating or arylating silanol moieties of the organosilicate glass dielectric film via silylation, and an activating agent which may be an acid, a base, an onium compound, a dehydrating agent, and combinations thereof, and a solvent or mixture of a main solvent and a co-solvent.