Trench Floating Gate Memory Structure Mitigating Short Channel Effects

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

As electronic devices shrink, the short channel effect and alignment difficulties in flash memory cells become significant challenges, necessitating a new memory structure and fabrication method to overcome these issues.

Innovation Solution

A memory structure is developed with floating gates embedded in trenches within the substrate and a control gate covering the floating gates, accompanied by a method that includes forming spacers, sacrificial layers, and dielectric layers to reduce alignment difficulties and mitigate the short channel effect.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of moving object

If the gate channel length is reduced to shrink memory device size, then the integration density is improved, but the short channel effect becomes more significant

Engineering Contradiction:
Improvememory device sizeVSAvoidshort channel effect
Core Design Contradiction:
Area of moving objectVSReliability

Solution Approach 1:

The gate structure is segmented into a control gate and floating gates positioned in trenches, creating a three-dimensional configuration that divides the gate function across multiple spatial locations. This segmentation allows better control over the channel region while maintaining compact device dimensions, effectively mitigating the short channel effect through improved electric field distribution.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention transitions from a planar gate structure to a three-dimensional configuration by positioning floating gates within trenches and placing the control gate above them. This dimensional change creates a vertically stacked architecture that enhances gate control over the channel without increasing the lateral footprint, thereby reducing the short channel effect while maintaining small device size.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Area of moving object

If the memory cell size is reduced, then the integration density is improved, but the alignment of elements becomes more difficult

Engineering Contradiction:
Improvememory cell sizeVSAvoidelement alignment
Core Design Contradiction:
Area of moving objectVSManufacturing precision

Solution Approach 1:

The floating gates are formed in trenches within the substrate before the control gate is deposited. This preliminary positioning of the floating gates establishes precise spatial references that guide subsequent processing steps, ensuring accurate alignment of the control gate and other elements even as device dimensions are reduced.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The floating gates embedded in the substrate act as intermediary structures that mediate between the substrate and the control gate. These intermediate elements provide stable alignment references and facilitate the precise positioning of upper layers, thereby maintaining manufacturing precision despite reduced memory cell size.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS7700991B2Two bit memory structure and method of making the same
Publication Date: 2010.04.20 NAN YA TECH
  • US7700991B2 patent drawing
  • US7700991B2 patent drawing
  • US7700991B2 patent drawing

AI summary

A method for fabricating the memory structure includes: providing a substrate having a pad, forming an opening in the pad, forming a first spacer on a sidewall of the opening, filling the opening with a sacrificial layer, removing the first spacer and exposing a portion of the substrate, removing the exposed substrate to define a first trench and a second trench, removing the sacrificial layer to expose a surface of the substrate to function as a channel region, forming a first dielectric layer on a surface of the first trench, a surface of the second trench and a surface of the channel region, filling the first trench and the second trench with a first conductive layer, forming a second dielectric layer on a surface of the first conductive layer and the surface of the channel region, filling the opening with a second conductive layer, and removing the pad.