Triangular Heat Exchanger for CMP Pad Temperature Control
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Solution Overview
Problem
Conventional CMP polishing apparatuses face challenges in maintaining the surface temperature of the polishing pad due to limited space for cleaning the heat exchanger, leading to potential scratches on the substrate and decreased semiconductor device yield.
Innovation Solution
A pad-temperature regulating apparatus with a heat exchanger of approximately triangular shape in horizontal cross-section, allowing for cleaning in a limited space by moving to a retreat position, equipped with a moving mechanism and a cleaning mechanism that includes a cleaning tank and oscillating mechanism for efficient cleaning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the heat exchanger is placed in contact with the polishing pad surface for temperature regulation, then the surface temperature of the polishing pad can be maintained at an optimum level, but dirt adheres to the heat exchanger and causes scratches on the substrate when it falls down
Solution Approach 1:
The heat exchanger is designed to be movable rather than fixed, allowing it to dynamically change position between contacting the polishing pad for temperature regulation and retreating to a cleaning position where it can be cleaned without occupying cleaning space
Solution Approach 2:
The heat exchanger is cleaned in advance at the cleaning position before returning to the temperature regulation position, preventing dirt from falling onto the substrate during polishing operations
2Area of stationary object
If the partition walls are moved closer to the polishing pad to downsize the apparatus, then the footprint of the polishing chamber is reduced, but sufficient cleaning space for the heat exchanger cannot be secured
Solution Approach 1:
The heat exchanger utilizes the vertical dimension by moving up and down between the polishing pad and the cleaning position, rather than requiring horizontal cleaning space. This allows the partition walls to be positioned closer to the polishing pad while still providing adequate cleaning capability
Solution Approach 2:
The movable heat exchanger transitions between different vertical positions - contacting the polishing pad for temperature regulation and moving to an upper cleaning position for maintenance, eliminating the need for additional horizontal cleaning space
3Reliability
If the heat exchanger is cleaned periodically, then the reliability of semiconductor devices is maintained by preventing scratches, but the cleaning process requires sufficient space that conflicts with apparatus downsizing requirements
Solution Approach 1:
The cleaning operation is performed in the vertical dimension by moving the heat exchanger to an upper cleaning position, rather than requiring horizontal space for cleaning equipment and operations
Solution Approach 2:
The heat exchanger serves its own cleaning needs by being movable to a cleaning position where it can be cleaned without requiring separate cleaning equipment or additional operators, maintaining reliability while minimizing apparatus complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables effective temperature regulation of the polishing pad while allowing for cleaning of the heat exchanger in a compact space, maintaining polishing rate and preventing substrate scratches.
Implementation Method 1
a heat exchanger configured to contact the polishing pad to exchange heat with the polishing pad
Implementation Method 2
a cleaning mechanism configured to clean the heat exchanger moved to the retreat position
Implementation Method 3
oscillating mechanism for efficient cleaning
Data Source
AI summary
A pad-temperature regulating apparatus is disclosed, which includes a heat exchanger capable of being cleaned in a limited space. A pad-temperature regulating apparatus includes a heat exchanger configured to contact a polishing pad to exchange heat with the polishing pad, a moving mechanism configured to move the heat exchanger between a temperature regulating position where the heat exchanger can exchange heat with the polishing pad, and a retreat position located on a side of the polishing pad, and a cleaning mechanism configured to clean the heat exchanger moved to the retreat position. The heat exchanger has an approximate triangular shape in a horizontal cross-section, and a longest side of the heat exchanger faces the polishing pad when the heat exchanger is moved to the retreat position.