Triazine Silane Laminate Bonding for High-Humidity Adhesion
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Solution Overview
Problem
Existing flexible circuit boards face challenges with adhesion between metal layers and resin substrates in high-temperature and high-humidity environments, and current methods are costly or inefficient.
Innovation Solution
A method involving a base layer of triazine-based silane coupling agents and a molecular bonding layer with catalytic triazine-based silane coupling agents is used to form a laminate, enhancing adhesion and preventing metal diffusion and oxide formation, with a surface treatment step to introduce functional groups and electroless plating to form a metal layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If copper foil is roughened to ensure adhesion between copper and resin substrate, then adhesion strength is improved, but transmission loss in high frequency range increases
Solution Approach 1:
A molecular bonding layer containing silane coupling agents is introduced as an intermediary between the copper foil and resin substrate. This layer provides both adhesion promotion and maintains a smooth surface for high-frequency signals, resolving the contradiction between adhesion strength and transmission loss
Solution Approach 2:
The invention uses a composite structure consisting of resin substrate, molecular bonding layer with silane coupling agents, and copper foil. This composite material approach allows simultaneous achievement of good adhesion and smooth surface properties
2Reliability
If adhesion strength improving layer and copper diffusion barrier layer are formed, then adhesion in high-temperature high-humidity environment is improved, but manufacturing cost increases
Solution Approach 1:
The molecular bonding layer containing silane coupling agents performs multiple functions simultaneously: it acts as an adhesion promoter, a diffusion barrier, and a surface smoothness layer. This multi-functionality reduces the need for separate layers, thereby lowering manufacturing cost while maintaining reliability
Solution Approach 2:
The invention changes the chemical parameters by using silane coupling agents with specific functional groups that can bond with both resin and metal, achieving improved adhesion and barrier properties through chemical modification rather than adding more physical layers
3Strength
If electroless plating is performed on resin surface, then metal layer adhesion is improved, but surface roughness increases
Solution Approach 1:
The molecular bonding layer is formed in advance on the resin substrate before electroless plating. This preliminary action creates a smooth, adhesive surface that prevents surface roughening during the subsequent electroless plating process, maintaining both adhesion and surface quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves excellent adhesion between metal and resin layers in high-temperature and high-humidity conditions while maintaining low costs, with improved peeling strength and reduced transmission loss.
Implementation Method 1
a molecular bonding layer forming step of forming a molecular bonding layer with a catalytic triazine-based silane coupling agent represented by the following Formula (2), on a surface of the base layer
Implementation Method 2
an electroless plating step of forming a metal layer on a surface of the molecular bonding layer supporting the catalyst by electroless plating
Implementation Method 3
there is a problem that the cost for forming the adhesion strength improving layer and the copper diffusion barrier layer is high
Data Source
AI summary
A method for manufacturing a laminate is a method for manufacturing a laminate including a resin substrate, and a metal layer provided on the resin substrate, the method including: a base layer forming step of forming a base layer with a base triazine-based silane coupling agent which is represented by the following Formula (1) directly or via another layer, on a surface of the resin substrate on which the metal layer is formed; and a molecular bonding layer forming step of forming a molecular bonding layer with a catalytic triazine-based silane coupling agent represented by the following Formula (2), on a surface of the base layer.