Semiconductor Package TSV Binary-Tree Testing for Local Malfunction Detection
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Solution Overview
Problem
Existing semiconductor package testing methods for through via structures, such as daisy chain schemes, are inadequate in identifying local malfunctions and often require additional circuit components, leading to inefficiencies in diagnosing malfunctions in through-silicon/substrate-via structures.
Innovation Solution
The semiconductor package incorporates a binary-tree structure for TSVs, where each TSV is coupled through branch structures, allowing for efficient local testing of TSV structures by propagating input and output test signals through these branches to identify malfunctions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If daisy chain testing scheme is used for TSV structures, then testing can be performed, but local malfunctions cannot be identified and additional circuit components are required
Solution Approach 1:
The patent divides the TSV testing into segmented groups where TSVs are organized in a tree structure with intermediate nodes. Each node can be tested independently by controlling switches to connect specific TSVs to test signal lines, enabling localized malfunction identification without requiring additional circuit components throughout the entire structure.
Solution Approach 2:
The patent introduces a hierarchical dimension to the testing scheme by organizing TSVs into multiple levels of a tree structure. Instead of a flat daisy chain arrangement, TSVs are grouped into nodes at different hierarchical levels, allowing testing to proceed from leaf nodes up to the root node, thereby enabling local malfunction identification through dimensional reorganization.
2Productivity
If traditional testing methods are used, then all TSVs can be tested, but testing efficiency is low and local malfunctions remain undetected
Solution Approach 1:
By segmenting TSVs into groups managed by intermediate nodes, the testing process can focus on specific segments independently. Switches control which TSVs are connected to test signal lines at each node, allowing efficient testing of local groups and rapid identification of malfunctioning segments without testing the entire TSV array sequentially.
Solution Approach 2:
Intermediate nodes act as mediators between individual TSVs and test signal lines. These nodes contain switches that control the connection between TSVs and testing circuitry, enabling efficient grouping and selective testing of TSV segments. The intermediate nodes facilitate localized testing by mediating the connection between multiple TSVs and the test equipment.
Data Source
AI summary
A semiconductor package includes an array of through-substrate-via (TSV) structures comprising a number (O) of TSV structures, wherein the array comprises a number (M) of active TSV structures; a number (N) of contact structures, the contact structures comprising a plurality of pairs configured to receive an input test signal and provide an output test signal, respectively; and a plurality of binary-tree branches, each of the plurality of binary-tree branches electrically coupling a first one of the active TSV structures to a second one of the active TSV structures and a third one of the active TSV structures.