3D IC Package with Through Silicon Vias and Cylindrical Studs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The integration of chips in 3D configurations poses challenges in minimizing device size, improving interconnect density, and reducing costs while maintaining high performance and reliability, as existing methods for through semiconductor vias are inefficient and lack effective solutions.
Innovation Solution
The method involves a package substrate with a first integrated circuit die having through silicon vias, coupled with cylindrical studs, and a second integrated circuit die mounted on the first die and studs for forming electrical connections, along with an optional molded package body and bond wires for additional connections, enabling efficient electrical and thermal pathways.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If through semiconductor vias are used to interconnect chips in a stack, then interconnect density is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent divides the interconnection system into multiple functional components: through silicon vias for vertical interconnects, cylindrical studs for mechanical and electrical support, and separate bonding interfaces. This segmentation allows each component to be optimized independently, reducing overall manufacturing complexity while maintaining high interconnect density
Solution Approach 2:
The patent transitions from planar 2D chip arrangements to 3D stacked configurations with vertical through silicon vias. This dimensional change enables significantly higher interconnect density by utilizing the vertical dimension, while the cylindrical studs provide structural support that manages the complexity introduced by 3D integration
2Volume of moving object
If chips are stacked in 3D configuration, then device size is reduced, but thermal management and reliability challenges increase
Solution Approach 1:
The cylindrical studs serve as intermediary elements between the through silicon vias and the chip packages. These studs provide both mechanical support and thermal conduction pathways, acting as mediators that manage the thermal and structural stresses introduced by 3D stacking while enabling miniaturization
Solution Approach 2:
The patent employs composite interconnection structures combining different materials with complementary properties: conductive materials for electrical interconnects, thermally conductive materials for heat dissipation, and mechanically strong materials for structural support. This composite approach addresses multiple challenges (electrical, thermal, mechanical) simultaneously, enabling reliable 3D stacking
Data Source
AI summary
A method of manufacture of an integrated circuit package system includes: providing a package substrate; mounting a first integrated circuit die, having through silicon vias, on the package substrate; coupling cylindrical studs to the package substrate adjacent to the first integrated circuit die; and mounting a second integrated circuit die, having through silicon vias, on the first integrated circuit die and the cylindrical studs for forming an electrical connection among the second integrated circuit die, the first integrated circuit die, the package substrate, or a combination thereof.