TSV Die Packaging With Sacrificial Carrier for Safe Planarization

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Solution Overview

Problem

Existing packaging technologies for integrated circuits face challenges in maintaining the integrity of through-semiconductor vias (TSVs) during encapsulation processes, leading to potential electrical shorts and yield loss due to inadequate planarization control.

Innovation Solution

The use of metal vias as a buffer structure during encapsulation, combined with a sacrificial carrier for mechanical support, ensures that the planarization process does not adversely affect the TSVs, and the sacrificial carrier is removed to reveal the metal vias, preventing electrical shorts.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If planarization process is performed on encapsulated composite die, then surface flatness is improved, but TSV integrity deteriorates due to potential removal or damage

Engineering Contradiction:

Improvesurface flatnessVSAvoidTSV integrity

Core Design Contradiction:

Manufacturing precisionVSReliability

Solution Approach 1:

Metal vias are formed on the TSVs before encapsulation and planarization processes. These pre-formed metal vias extend through the encapsulant material and serve as a protective buffer during planarization, ensuring that the TSVs are not adversely removed or damaged while still achieving the desired surface flatness

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The metal vias act as a cushioning protective layer between the planarization process and the TSVs. During planarization, the metal vias absorb the mechanical action, preventing direct contact and potential damage to the underlying TSVs, thus cushioning the TSVs from planarization-induced stress

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

2Stability of the object's composition

If sacrificial carrier is used for mechanical support during bonding, then handling stability is improved, but process complexity increases due to additional attachment and removal steps

Engineering Contradiction:

Improvehandling stabilityVSAvoidprocess complexity

Core Design Contradiction:

Stability of the object's compositionVSDevice complexity

Solution Approach 1:

A sacrificial carrier is attached to the backside of the device die to provide mechanical support during bonding and encapsulation processes. The carrier is intentionally designed as a temporary, disposable component that is removed after serving its protective function, enabling the use of fragile thin dies without the need for permanent complex support structures

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Data Source

PatentUS20250357234A1PACKAGING OF DIES INCLUDING TSVs USING SACRIFICIAL CARRIER

Publication Date: 2025.11.20 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A method includes bonding a composite die on a redistribution structure. The composite die comprises a device die including a semiconductor substrate, a through-semiconductor via penetrating through the semiconductor substrate, a metal via at a surface of the device die, and a sacrificial carrier attached to the device die. The composite die is encapsulated in an encapsulant. A planarization process is performed on the composite die and the encapsulant, and the sacrificial carrier is removed to reveal the metal via. A conductive feature is formed to electrically couple to the metal via.