Tubular Sputtering Target With Damping Element
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Solution Overview
Problem
Tubular targets for cathode sputtering installations are prone to mechanical stress and crack formation due to rotational and thermal stresses, leading to potential loss of vacuum tightness and reduced service life, especially when using materials with differing coefficients of thermal expansion.
Innovation Solution
A tubular target design featuring a monolithic target body with dissimilar ends, connected via a vacuum-tight and twist-secured connector piece, incorporating a damping element between the target body and connector piece to distribute stress uniformly, and using materials with matched thermal expansion coefficients, and employing adhesives or solders for a stable and conductive connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a tubular target body is used for cathode sputtering, then the degree of utilization increases to 70-90% and cooling efficiency improves, but mechanical stress and crack formation occur due to rotational and thermal stresses
Solution Approach 1:
The target body is divided into a monolithic tubular structure without continuous support tubes, creating a more robust single-piece construction that resists crack formation while maintaining high material utilization through rotational sputtering
Solution Approach 2:
The patent employs materials with matched thermal expansion coefficients for the target body and end caps, creating a composite structure that withstands thermal stress during high-power sputtering operations without developing cracks
2Productivity
If high energy densities up to 30 kW/m are applied to monolithic targets, then deposition rates and production efficiency increase, but thermal stress and potential target failure increase
Solution Approach 1:
The patent optimizes wall thickness parameters (preferably less than 4 mm) and employs materials with matched thermal expansion coefficients to manage thermal stress during high-energy-density sputtering, enabling sustained high deposition rates without target failure
Solution Approach 2:
End caps are introduced as intermediary components that distribute thermal stress away from the target body, allowing high energy densities to be applied during sputtering while preventing thermal stress-induced failure through proper material matching
3Productivity
If very thin wall thicknesses less than 4 mm are used in monolithic targets, then material yield increases and production efficiency improves, but mechanical strength and damage resistance decrease
Solution Approach 1:
The patent optimizes wall thickness to be very thin (preferably less than 4 mm) to maximize material yield, while compensating for reduced mechanical strength through end cap reinforcement and materials with matched thermal expansion coefficients that prevent stress concentration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design significantly extends the service life of the target by reducing crack formation and maintaining vacuum tightness, while ensuring mechanical stability and efficient electrical conductivity, even under high energy densities and thermal stress.
Implementation Method 1
incorporating a damping element between the target body and connector piece to distribute stress uniformly
Implementation Method 2
A target is to be understood to be a sputtering source for a cathode sputtering installation. In cathode sputtering a target material is 'sputtered' by means of plasma and is deposited as a thin layer on a substrate
Implementation Method 3
a magnetic field is additionally generated in magnetron sputtering. On account of the electric field and the magnetic field being superimposed, the path of the charge carriers is extended and the number of impulses per electron is increased
Implementation Method 4
Cooling of the target, which is implemented in the internal space of a tube target, on account of the more favourable heat transfer in a tubular target, is significantly more effective than in planar targets, enabling higher energy densities on the surface
Data Source
AI summary
A target for a cathode sputtering system has a tubular target body made of a sputtering material and at least one connector piece, which is connected to the target body and projects from the target body, for attaching the target body to the cathode sputtering system. The target body is connected to the at least one connector piece in a vacuum-tight manner and the two are rotationally fixed relative to one another. At least one damper element is provided between the at least one connector piece and the target body.