Twin Planar Motor Stage for Parallel Wafer Metrology Alignment
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Solution Overview
Problem
Current semiconductor metrology systems face challenges in throughput and operation cost due to the serial nature of wafer alignment and metrology processes, which reduce efficiency and increase costs.
Innovation Solution
A metrology system utilizing magnetic levitation technology, where substrates are supported by carriers with arrays of magnets over a stator with electromagnetic coils, allowing for independent movement and alignment of multiple substrates in parallel, thereby improving throughput and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a single stage is used for serial wafer alignment and metrology, then alignment precision can be maintained, but throughput decreases and operation cost increases
Solution Approach 1:
The system divides the single stage into multiple independent stages (first stage and second stage), each capable of holding and processing substrates independently. This segmentation allows parallel processing of multiple substrates while maintaining individual alignment precision for each stage, thereby resolving the contradiction between maintaining measurement precision and improving throughput.
2Manufacturing precision
If serial processing is used on a single stage, then alignment accuracy can be ensured, but processing time increases
Solution Approach 1:
By segmenting the processing system into multiple independent stages, each substrate can undergo alignment and metrology simultaneously on different stages. This eliminates the sequential waiting time inherent in single-stage serial processing while each stage maintains its alignment accuracy through independent control and pre-mapping capabilities.
Solution Approach 2:
The system performs pre-mapping of the stage positions and characteristics before actual substrate processing. This preliminary action allows the control system to compensate for stage variations and maintain alignment accuracy across multiple parallel stages, enabling time-saving parallel processing without sacrificing precision.
3Productivity
If multiple substrates are processed in parallel, then throughput increases, but system complexity increases
Solution Approach 1:
The system uses multiple independent stages that are structurally similar but functionally independent, allowing parallel substrate processing. Each stage can be controlled independently with identical control algorithms, which manages system complexity by repeating proven designs rather than creating a completely new complex system.
Solution Approach 2:
Each stage is designed to be universal and multi-functional, capable of performing both alignment and metrology functions. This universality reduces system complexity by using the same hardware for multiple purposes across different stages, rather than requiring specialized equipment for each function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves increased throughput by allowing multiple substrates to be processed in parallel, and reduces operation costs by optimizing the planar alignment and measurement processes, leading to more efficient semiconductor manufacturing.
Implementation Method 1
A metrology system utilizing magnetic levitation technology, where substrates are supported by carriers with arrays of magnets over a stator with electromagnetic coils
Implementation Method 2
a stator with electromagnetic coils, allowing for independent movement and alignment of multiple substrates in parallel
Implementation Method 3
The controller may be further configured to energize at least some of the plurality of electromagnetic coils to apply a differential force to the first carrier or the second carrier to adjust a planar alignment
Data Source
AI summary
A system includes a stator, and a first carrier and a second carrier disposed over a horizontal surface of the stator. A plurality of electromagnetic coils are disposed in an array beneath the horizontal surface. The first carrier and the second carrier each include plurality of magnets arranged in an array and are configured to support a first substrate and a second substrate, respectively. A controller is configured to individually energize each of the plurality of electromagnetic coils, which causes the first carrier and the second carrier to levitate above the horizontal surface and independently move in a loop relative to the horizontal surface. The plurality of electromagnetic coils can apply a differential force to adjust a planar alignment of the first substrate or the second substrate, and a metrology tool can take one or more measurements of the first substrate or the second substrate.