Twisted-Path Abrasive Segments for Wafer Grinding
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Solution Overview
Problem
Conventional grinding wheels face challenges in efficiently preparing and finishing sensitive workpieces, such as wafers, due to limitations in their design and composition, which affect grinding performance and surface finish quality.
Innovation Solution
The development of abrasive articles with specific designs and compositions, including abrasive segments with arm portions, cavities, and a twisted path, where the abrasive grains are embedded in a bond material, enhancing the cutting distance and edge ratios, and incorporating a high cavity volume percentage to improve grinding efficiency and surface finish.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional grinding wheels are used, then grinding operation can be performed, but grinding performance and surface finish quality are insufficient for sensitive workpieces
Solution Approach 1:
The grinding wheel is divided into multiple segments with different abrasive grain sizes and bond types arranged in specific patterns. This segmentation allows different regions of the wheel to perform different functions - some regions for material removal while others provide fine finishing, thereby achieving both high productivity and superior surface finish quality simultaneously
Solution Approach 2:
Different portions of the grinding wheel are assigned different local properties including varying abrasive grain compositions, bond material types, and structural characteristics. This local differentiation enables optimized performance for specific grinding tasks on sensitive workpieces while maintaining overall wheel functionality
2Duration of action of stationary object
If conventional grinding wheel design is used, then basic grinding function is achieved, but tool life is limited and wear is excessive
Solution Approach 1:
The grinding wheel employs a composite structure combining multiple bond materials with different wear resistance characteristics and abrasive grain types. This composite approach creates a wheel where the bond material provides structural integrity and wear resistance while the abrasive grains perform the cutting function, extending tool life by reducing excessive wear
Solution Approach 2:
The wheel design utilizes optimized parameters including specific ratios of abrasive grain sizes, bond material compositions, and structural density. These parameter optimizations enhance the wheel's resistance to wear and extend its operational life while maintaining effective grinding performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The abrasive articles demonstrate improved grinding performance and stable grinding forces, achieving better surface finish and extended tool life by optimizing the cutting action and reducing wear, particularly suitable for sensitive materials like silicon carbide and sapphire wafers.
Implementation Method 1
The abrasive surface of the grinding wheel wears down the surface of the work by the collective cutting action of abrasive grains of the grinding wheel
Implementation Method 2
Bonded abrasive tools are generally composites having three structural elements or phases: abrasive grain, bond, and porosity
Data Source
AI summary
An abrasive article for use with a grinding wheel including an abrasive body having abrasive grains contained within a matrix of bond material, the abrasive body having a plurality of arm portions defining a twisted path having a plurality of linear portions joined by a plurality of turns.