Revolution Surface Grinding Machines TRIZ Cases

Abrasive segments with twisted paths and cavities improve cutting distance and edge ratios in grinding tools.

An isostatic pressing member with planar surfaces and a vertical wing provides stable clamping on anode rods in aluminum production cells.

A grinding tool with a conical region machines cylinder bores in one pass to reduce machining time.

Distance detectors measure membrane position to control air bag pressure and correct wafer bending during chemical mechanical polishing.

Torsionally coupled grinding spindles use inclinometers and distance sensors to determine radial and axial correction values.

A support blade with a segmented work profile contacts a workpiece at varying angles, reducing lobe formation by eliminating the need for blade replacement.

Dynamic pressure control via a swingable polishing pad resolves uniformity trade-offs during substrate planarization.

A grinding center merges two compound slide rests into one common structure to grind main and pin bearings simultaneously, reducing device complexity.

Immobile flat contact surfaces support workpieces in centerless cylindrical grinding machines.

A prism refracts light onto a rotating roll surface while a line scan camera captures sequential pixel rows for high-resolution imaging.

Aligning the tilt arm center with the grindstone rotation simplifies gauge application paths, reducing measurement time and impact risk on crankpins.

An angled bolster positions a blade at a fixed sharpening angle to maintain consistent contact during the sharpening process.

Conical fixing grooves at two radial distances arrange carrier plates in rows, reducing circular grinding tracks on hard floors.

Composite magnetic and damping layers stabilize the retainer ring, preventing wafer slipping and vibration.

A crankpin checking apparatus uses a parallelogram linkage to guide measurement contact.

Real-time optical monitoring tracks material removal across the substrate during chemical mechanical polishing to determine the precise endpoint.

An offset pressing plane generates a transverse force to hold rotationally symmetric workpieces during fine machining.

A fine-machining device applies deceleration and acceleration forces to a bearing member for uniform pressing.

A cryogenic system hardens and mechanically removes the inner lining sealing agent layer from end-of-use pneumatic tires.

Pivoting tool holder head moves along a guide rail to machine radial grooves in stationary blade carriers.

Aligning rotation axes vertically and integrating a dressing unit improves machining accuracy while maintaining structural simplicity.

A combined grinding and honing device uses a pivotable stone holder driven by a regulating wheel to process workpieces.

Segmented guide assemblies with independent micrometric adjustments resolve alignment precision versus device complexity contradictions in centerless grinding.

A gauge uses compressed air through a pneumatic conduit to create an internal pressure barrier that seals the casing against coolant and foreign matter.

Opposite pens detach residual fat from poultry fillets, eliminating manual labor and improving processing efficiency.

A flexible membrane decouples a CMP retaining ring from the carrier head to distribute polishing pressure uniformly across the substrate edge.

A release agent prevents uneven fluid penetration into a porous subpad, ensuring uniform compressibility and adhesion for silicon wafer planarity.

Segmented tool insertion eliminates twist and feed marks on workpieces using conventional lathes.

Laser-formed modification layers guide peripheral removal in bonded substrates, preventing chipping and cracking caused by uneven grinding forces.

Light irradiation activates photocatalyst grains on the grinding wheel, oxidizing gallium nitride surfaces to reduce wear and improve processing quality.

Radially shifting the buffing position prevents localized surface deterioration from repeated curing, maintaining durability equivalent to new tires.

Tapered guide pins center work pieces on a mounting table, preventing vibration and displacement during transfer to the top ring.

Thick rim portion and extension fit into carrier head recess to seal cavity against manufacturing tolerances and prevent leaks.

Recessed handle geometry allows a sharpening element to reach the base of odd-shaped lopper blades while protecting user fingers from injury.

A carrier with a mounting pad and adhesion sheet secures glass to the lower unit support during polishing operations.

A universal abrasive disc uses six strategically positioned openings to align with various dust collection systems.

Spring-loaded stones adjust contact pressure automatically, resolving the contradiction between high honing precision and complex positioning mechanisms.

A narrow microfinishing shoe adapts to varying journal lengths, reducing downtime from specialized tooling changes.

A non-contact affected layer detection sensor mounted on a displacing arm portion measures workpiece surface states without physical wear.

High diamond concentration and mixed filler particles in a resin bonded grinding wheel reduce dressing frequency while maintaining cut rate.

Dynamic thresholding of drive current relative to rotational phase enables reliable slip detection, reducing safety margins and shortening machining time.

Femtosecond laser match honing eliminates grading steps by adapting needle dimensions to injector bodies, reducing inventory costs.

Segmented grinding wheel bodies allow targeted maintenance of tapered rollers, restoring machining accuracy without replacing the entire unit.

Segmented grooves on CMP retainer rings drain slurry to prevent contamination and reduce substrate scratch defects.

An inclined lifting mechanism demounts large wafers by overcoming surface tension adhesion without requiring pad grooves or overhanging the apparatus.

Flat contact geometry eliminates notch errors during alignment, ensuring precise positioning without complex detection mechanisms.

Vertical ceiling door movement prevents abrasive leakage and contamination during vacuum blasting operations.

Independent CNC-controlled supporting parts reduce concentricity errors below 1 μm by aligning sub-centrally against eccentric regions.

A crystal orientation adjustment fixture uses movable components to fine-tune workpiece alignment during grinding operations.