Two-part lidded semiconductor package warpage control

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Semiconductor packages face challenges with warpage and thermal performance, particularly in large die sizes due to differences in thermal expansion coefficients between silicon and laminate materials, which affect solder mountability and heat dissipation efficiency.

Innovation Solution

A lidded semiconductor package with a two-part lid system, featuring a removable cover plate and annular lid base with a sliding mechanism, allowing for improved warpage control and thermal management by enabling the installation of a heat sink directly on the bare die after the surface mount process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a lidded semiconductor package is used, then warpage control and SMT process reliability are improved, but thermal performance and heat dissipation efficiency deteriorate

Engineering Contradiction:

ImproveSMT process reliabilityVSAvoidheat dissipation efficiency

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The lid is divided into two separate parts: a fixed annular lid base that provides structural support and warpage control, and a removable cover plate that can be taken off to access the die for heat sink attachment. This segmentation allows the package to benefit from both the mechanical stability of a lidded structure and the thermal performance of direct die-to-heat-sink contact.

Inventive Principle:

Principle #1Segmentation

2Temperature

If a stiffener ring is used, then thermal performance and heat dissipation efficiency are improved, but warpage control and SMT process reliability deteriorate

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidSMT process reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The lid structure is segmented into a fixed annular base and a removable cover plate. The annular base remains attached to provide the necessary mechanical reinforcement and warpage control during SMT processing, while the cover plate can be removed to allow direct heat sink attachment to the die for improved thermal performance.

Inventive Principle:

Principle #1Segmentation

3Stability of the object's composition

If a fixed lid is used, then structural support and warpage control are improved, but adaptability for different thermal management solutions deteriorates

Engineering Contradiction:

Improvewarpage controlVSAvoidthermal management adaptability

Core Design Contradiction:

Stability of the object's compositionVSAdaptability or versatility

Solution Approach 1:

The cover plate is designed with movable and removable characteristics, allowing it to be detached when thermal management modifications are needed. This dynamic design enables the system to adapt to different thermal management requirements while maintaining structural integrity during normal operation.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The removable cover plate design allows the same package structure to accommodate multiple thermal management approaches. Users can attach different types of heat sinks or thermal management devices directly to the die based on specific application requirements, making the package universally adaptable to various thermal management solutions.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20230060065A1Lidded semiconductor package

Publication Date: 2023.02.23 MEDIATEK INC

AI summary

A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The two-part lid comprises an annular lid base and a cover plate removably installed on the annular lid base.