Two-Phase Immersion Cooling System for High-Density Processors
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current liquid cooling techniques for high-power density information technology systems are inefficient, environmentally hazardous, and impractical due to operation at atmospheric pressures and the use of high boiling point dielectric fluids, which limits their effectiveness in managing heat from advanced CPUs, GPUs, and DPUs.
Innovation Solution
A two-phase immersion cooling system utilizing a pressure vessel with a two-phase refrigerant that flows past processors via thermosyphon, where the refrigerant's liquid phase covers the processors and condenser tubes are positioned above to condense the gaseous phase, with a controller regulating cooling fluid flow based on temperature and power consumption to efficiently remove heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If air-cooling techniques are used for high-power density IT systems, then the system structure is simple and easy to implement, but the cooling efficiency becomes insufficient when power density exceeds 5 W/cm²
Solution Approach 1:
The patent transitions from air-cooling (gas-based) to liquid immersion cooling (hydraulic-based). The cooling fluid circulates through the system, absorbing heat from processors directly through immersion contact, enabling effective heat removal at power densities exceeding 5 W/cm² while maintaining system simplicity
Solution Approach 2:
The patent utilizes two-phase refrigerant cycle where the cooling fluid undergoes phase transitions (liquid to vapor and back) to absorb and reject heat. The refrigerant evaporates at the heat source (processors) absorbing latent heat, then condenses at the heat exchanger releasing heat, providing highly efficient thermal management
2Reliability
If high boiling point dielectric fluids are used for liquid cooling, then electrical insulation is improved, but environmental hazards and operational costs increase
Solution Approach 1:
The patent changes the physical and chemical parameters of the cooling fluid by using refrigerants with lower boiling points and appropriate dielectric properties. This allows the system to operate with fluids that provide sufficient electrical insulation while being environmentally friendly and cost-effective
Solution Approach 2:
The patent employs readily available, inexpensive refrigerants that can be easily replaced or refilled. The system uses common refrigerant types that are cost-effective and have reduced environmental impact compared to specialized high-boiling-point dielectric fluids
3Device complexity
If atmospheric pressure operation is used for liquid cooling, then system complexity is reduced, but cooling performance becomes insufficient for high power densities
Solution Approach 1:
The patent employs a two-phase refrigerant system where controlled phase transitions occur at different pressure zones. The refrigerant evaporates at low pressure near the processors and condenses at higher pressure in the heat exchanger, enabling efficient heat transfer that overcomes the limitations of atmospheric pressure operation
Solution Approach 2:
The patent implements a pressurized liquid circulation system with pumps and pressure-regulated components. This hydraulic system maintains controlled pressure differentials to drive refrigerant flow through the immersion chamber and heat exchanger, achieving superior cooling performance for high-power-density applications
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This system provides efficient heat removal for high-power density IT systems, reducing environmental hazards and operational costs while maintaining effective cooling performance, even at elevated power densities beyond 5 W/cm².
Implementation Method 1
a two-phase refrigerant... The refrigerant can be configured to extract heat from the processor(s)
Implementation Method 2
one or more of the condenser tube(s) are positioned above the liquid phase of the refrigerant, such that the condenser tube(s) can condense a gaseous phase of the refrigerant
Implementation Method 3
The refrigerant can flow past the processor(s) by thermosyphon
Data Source
AI summary
A two-phase immersion cooling system can include a pressure vessel with one or more processors, a two-phase refrigerant, and one or more condenser tubes within the vessel. The refrigerant can flow past the processor(s) by thermosyphon. The refrigerant can be configured to extract heat from the processor(s). In at least one embodiment, a liquid phase of the refrigerant can fully, or at least partially, cover the processor(s). The condenser tube(s) can be configured to receive cooling fluid into and transmit cooling fluid out of the vessel, thereby removing heat from the vessel.