Two-phase immersion cooling system and heat conduction device thereof

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Solution Overview

Problem

Existing immersion cooling systems face challenges in effectively cooling components that are partially or fully submerged in a vapor phase, as direct contact with liquid-phase working fluid is not always feasible, leading to inefficient heat dissipation and potential performance degradation.

Innovation Solution

A heat conduction device with a heat conduction element and boiling-assisting structure is introduced, where the first section is immersed in the liquid-phase section to facilitate heat exchange with a liquid-phase working fluid, while the second section connects to the component to be cooled, allowing for efficient heat transfer and boiling-assisted cooling.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If components are immersed in liquid-phase working fluid for effective cooling, then heat dissipation efficiency is improved, but direct liquid contact may cause corrosion or electrical short circuiting

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidcomponent reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The system divides the working fluid into two distinct phases: liquid-phase for heat absorption and vapor-phase for component immersion. The heat conduction element acts as an interface between these phases, allowing heat transfer without direct liquid contact with electronic components.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The heat conduction element serves as an intermediary between the liquid-phase working fluid and the component to be cooled. It conducts heat from the component through its structure to the liquid-phase fluid, enabling indirect cooling while maintaining component reliability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If components are placed in vapor phase to avoid liquid contact, then component reliability is maintained, but heat dissipation efficiency deteriorates

Engineering Contradiction:
Improvecomponent reliabilityVSAvoidheat dissipation efficiency
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The system utilizes phase change dynamics between liquid and vapor phases of the working fluid. The liquid-phase section absorbs heat through conduction and convection, while the vapor-phase section provides thermal insulation and protects components from liquid contact, optimizing both reliability and heat dissipation.

Inventive Principle:
Principle #29Pneumatics and hydraulics

Solution Approach 2:

The working fluid undergoes phase transitions between liquid and vapor states to facilitate heat transfer. Liquid-phase fluid absorbs heat from the heat conduction element, vaporizes, and then condenses back to liquid in a continuous cycle, enabling efficient heat dissipation without direct liquid contact with components.

Inventive Principle:
Principle #36Phase transitions

3Temperature

If heat conduction element extends into liquid-phase section for heat exchange, then heat transfer efficiency is improved, but device complexity increases

Engineering Contradiction:
Improveheat transfer efficiencyVSAvoiddevice complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The heat conduction element performs multiple functions simultaneously: it serves as a thermal conductor from the component to the liquid-phase fluid, acts as a structural support for the component in the vapor phase, and provides a surface for boiling-assisted heat transfer. This multi-functionality reduces the need for additional separate components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system enables rapid and effective heat dissipation from components in the vapor phase by leveraging boiling-assisted heat transfer, maintaining component performance and extending its service life without direct liquid contact.

Implementation Method 1

The heat conduction element has a first section and a second section, wherein the first section is in the liquid-phase section, and the second section is connected to the at least one portion of the device to be cooled

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The boiling-assisting structure is on the first section

Methodology Applied
Scientific EffectBoiling: Boiling

Implementation Method 3

The work tank has a vapor section and a liquid-phase section. The liquid-phase section is adapted to contain a liquid-phase working fluid

Methodology Applied
Scientific EffectPhase change: Phase Change

Implementation Method 4

The heat conduction element is adapted to contain a heat conduction fluid

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS12557244B2Two-phase immersion cooling system and heat conduction device thereof
Publication Date: 2026.02.17 WIWYNN CORP
  • US12557244B2 patent drawing
  • US12557244B2 patent drawing
  • US12557244B2 patent drawing

AI summary

A two-phase immersion cooling system includes a work tank, a device to be cooled, and a heat conduction device. The work tank has a vapor section and a liquid-phase section to contain a liquid-phase working fluid. At least one portion of the device to be cooled is in the vapor section. The heat conduction device including a heat conduction element and a boiling-assisting structure has a closed space to contain a heat conduction fluid to have the heat conduction fluid flow inside the closed space. The heat conduction element has a first section in the liquid-phase section and a second section connected to the at least one portion of the device to be cooled. The boiling-assisting structure is connected to the first section and exposed to the liquid-phase section of the work tank, thereby causing bubble nucleation at a heterogeneous interface between the boiling-assisting structure and the liquid-phase working fluid.