Modular Control Box for UAVs with Integrated SOM Circuit Board
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Solution Overview
Problem
Traditional backplane architectures for unmanned aerial vehicles (UAVs) face challenges such as structural performance issues due to high-stress environments, limited processing capability, and increased weight and space requirements, which can lead to mechanical and electrical failures and reduced computational abilities.
Innovation Solution
A modular control box design featuring a system-on-module (SOM) circuit board with heterogeneous processing systems and a carrier module, along with a heat sink and stiffener structure for improved thermal management, provides centralized control of vehicle and mission functions while minimizing weight and space requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional backplane architectures are used for UAV control systems, then individual hardware components can be provided for each control system, but the weight and space requirements increase significantly
Solution Approach 1:
The patent combines multiple individual hardware components into a single integrated control box that houses both the vehicle control system and mission control system. The backplane architecture is replaced with a unified PCB design that consolidates previously separate components, thereby reducing overall weight while maintaining functional versatility.
Solution Approach 2:
The control box is designed as a universal platform that can perform multiple functions - both vehicle control and mission control - through a single integrated unit. This multi-functional design eliminates the need for separate dedicated hardware for each control function, reducing weight and space requirements.
2Adaptability or versatility
If traditional backplane architectures are used for UAV control systems, then individual hardware components can be provided for each control system, but the space requirements increase significantly
Solution Approach 1:
The patent merges multiple control system components into a single compact control box with integrated PCBs. This consolidation reduces the volumetric space required compared to having separate hardware units for vehicle control and mission control, while preserving all necessary functional capabilities.
Solution Approach 2:
The control box employs a nested arrangement where the PCB is mounted within the control box housing, and various control components are integrated onto the PCB itself. This nesting approach maximizes space efficiency by placing components within available spaces and utilizing vertical mounting orientations.
3Device complexity
If traditional backplane architectures are used, then control systems can be provided with separate components, but structural performance deteriorates in high-stress environments
Solution Approach 1:
The patent integrates control components onto a unified PCB structure that provides enhanced mechanical strength and structural integrity compared to separate backplane assemblies. The integrated design reduces connection points and potential failure modes, improving reliability in high-stress UAV operating environments.
4Device complexity
If traditional backplane architectures are used, then control systems can be assembled with separate components, but processing capability is limited
Solution Approach 1:
The control box integrates high-performance processing units onto the PCB, combining vehicle control processing and mission control processing in a unified architecture. This integration enables enhanced processing capability through shared resources and optimized data flow between control functions, surpassing the limitations of separate backplane systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modular design enhances processing capabilities, improves structural performance, and reduces weight and space requirements, providing reliable and efficient control of UAVs in high-stress environments.
Implementation Method 1
a heat sink removably connected to the housing such that the circuit board is positioned between the housing and the heat sink. The circuit board is in contact with the heat sink.
Implementation Method 2
a heat sink removably connected to the housing such that the circuit board is positioned between the housing and the heat sink
Data Source
AI summary
A SOM circuit board includes a main body having a first face surface, an opposing second face surface, a first side surface, an opposing second side surface, a first end surface, and an opposing second end surface. The first and second side surfaces have maximum lengths along a longitudinal direction which are greater than maximum lengths of the first and second end surfaces along a lateral direction. The SOM circuit board further includes a plurality of computing components, each of the plurality of computing components mounted on one of the first face surface or the second face surface. The SOM circuit board further includes an input/output connector mounted on the second face surface. The SOM circuit board further includes a plurality of mounting holes extending along the transverse direction through and between the first face surface and the second face surface.