Semiconductor UBM Auxiliary Component for Junction Buffering
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packaging conductive structures face limitations in junction buffer capability and conductivity due to the structural and material limitations of the bump on the under bump metal (UBM), leading to potential breakage and failure of the semiconductor chip.
Innovation Solution
The introduction of an auxiliary component within the packaging conductive structure, made of polyimide, which provides an elastic buffer and increases the contact area between the bump conductive layer and the UBM, enhancing junction buffer capabilities and conductivity by rearranging the UBM and bump conductive layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the bump conductive layer is directly formed on the UBM, then the manufacturing process is simple, but the junction buffer capability is insufficient and breakage may occur
Solution Approach 1:
An auxiliary component made of polyimide material is introduced as an intermediary layer between the UBM and the bump conductive layer. This auxiliary component provides elastic buffer capability to prevent breakage while maintaining manufacturing feasibility. The auxiliary component includes a buffer region that can elastically deform to absorb stress during the bonding process.
2Ease of manufacture
If the contact area between bump conductive layer and UBM is small, then the manufacturing process is simpler, but the conductivity is insufficient
Solution Approach 1:
The auxiliary component extends in the lateral direction beyond the UBM edges, creating an extended contact area in the horizontal dimension. This allows the bump conductive layer to form a larger contact area with the auxiliary component, improving conductivity without significantly complicating the vertical stacking structure.
3Volume of moving object
If the bump conductive layer is formed only on the UBM, then the structure is compact, but the contact area is limited and conductivity is poor
Solution Approach 1:
The auxiliary component is formed as a thin film structure made of polyimide that can be deposited as a flexible layer extending laterally. This thin film approach increases the contact area between the bump conductive layer and the underlying structure without significantly increasing the overall volume or height of the packaging structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced junction buffer and increased contact area significantly reduce the likelihood of breakage and improve conductivity, ensuring the reliability and performance of the semiconductor chip packaging.
Implementation Method 1
at least one auxiliary component is formed on the UBM... This auxiliary component may also provide an elastic buffer to further enhance the capability of junction buffer and lower the possibility of breakage between the bump and bump conductive layer
Data Source
AI summary
A packaging conductive structure for a semiconductor substrate and a method for manufacturing the structure are provided. The structure comprises an under bump metal (UBM) that overlays a pad of the semiconductor substrate. At least one auxiliary component is disposed on the UBM. Then, a bump conductive layer is disposed thereon and a bump is subsequently formed on the bump conductive layer. Thus, the bump can electrically connect to the pad of the semiconductor substrate through the UBM and the bump conductive layer and can provide better junction buffer capabilities and conductivity.