Ultra-thin Dielectric PCBs with Disposable Base Support
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Solution Overview
Problem
Existing methods for manufacturing thin dielectric multilayer printed circuit boards face challenges in forming ultra-thin dielectric layers that are thinner than adjacent conductor layers, leading to reliability issues and limitations in creating very thin PCBs.
Innovation Solution
A method involving the use of a disposable base with detachable adhesive layers to support the build-up of conductive and dielectric layers, allowing for the formation of ultra-thin dielectric layers between conductive layers, which are then patterned, filled, and planarized to achieve the desired thickness, with the option to repeat layers for increased rigidity and efficient lamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If traditional laminate and dielectric prepreg formation structure are used, then PCB can provide electrical interconnections and integrate electrical characteristics, but PCB size and thickness cannot be sufficiently reduced
Solution Approach 1:
The PCB is divided into multiple thin layers (conductive layers and dielectric layers) that are sequentially formed and laminated. Each layer is processed independently to achieve precise thickness control while maintaining electrical integrity through controlled vias and interconnections between layers.
Solution Approach 2:
The invention transitions from traditional thick laminate structures to a multi-layer thin-film architecture, effectively reducing thickness in the vertical dimension while distributing electrical interconnections across multiple horizontal planes to maintain reliability.
2Length of moving object
If carrier substrate is used to form thin dielectric layers, then thin dielectric PCB can be achieved, but electrical patterns cannot be formed on conductive layers prior to laminating
Solution Approach 1:
Electrical patterns are formed on conductive layers before the lamination process. The method includes forming conductive layers with patterns, creating vias, and establishing electrical interconnections in advance, allowing subsequent dielectric layers to be laminated onto the pre-patterned structure without compromising manufacturing ease.
Solution Approach 2:
Instead of forming patterns after lamination as in traditional methods, the invention inverts the sequence by forming electrical patterns on conductive layers first, then laminating dielectric layers onto the pre-patterned structure, enabling both thin dielectric layers and easy pattern formation.
3Length of moving object
If dielectric layers are made ultra-thin, then thinner PCB can be created, but rigidity of the structure decreases
Solution Approach 1:
The PCB employs a composite structure alternating between conductive layers (typically copper) and dielectric layers. The conductive layers provide structural reinforcement and rigidity, while the dielectric layers provide electrical insulation and signal transmission, creating a balanced composite that achieves both thinness and structural integrity.
Solution Approach 2:
The invention utilizes thin-film technology to create ultra-thin dielectric layers that maintain sufficient mechanical strength through precise thickness control and material selection, allowing the overall structure to achieve reduced thickness while maintaining adequate rigidity for electronic applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of ultra-thin dielectric printed circuit boards with improved rigidity and electrical characteristics, allowing for thinner conductor and dielectric layers, thus addressing the limitations of traditional PCB manufacturing methods.
Implementation Method 1
A disposable base 104 may be used to support a build-up of conductive and dielectric layers that may be detachably coupled to the disposable base 104 by an adhesive layer 106
Implementation Method 2
A PCB is formed by laminating a plurality of conducting layers with one or more non-conducting layers
Data Source
AI summary
Ultra-thin dielectric printed circuit boards (PCBs) are provided. An ultra-thin dielectric layer may be coupled to a first conductive layer on a first side of the ultra-thin dielectric layer. A second conductive layer may be coupled to a second side of the ultra-thin dielectric layer, and the ultra-thin dielectric layer is thinner than at least one of the first conductive layer and the second conductive layer. The second conductive layer may be patterned to form electrical paths. The patterned second conductive layer may be filled with a dielectric filler. One or more conductive layers and one or more ultra-thin dielectric layers may also be coupled to the second conductive layer.